Method and apparatus for manufacturing circuit board
View Patent ↗A mask film, where squeegee cleaning part has been formed at a predetermined position, and another mask film are attached to both sides of a substrate. A through-hole is formed by using a laser, and conductive paste is filled into the through-hole by using a squeezing method. As discussed above, a paste-residue can be prevented on the through-hole, so that a circuit board having high quality of connection can be obtained.
1. A method for manufacturing a circuit board comprising:
attaching a mask film to a substrate in at least one squeegee area, the mask film including a first surface opposite a surface attached to the substrate;
forming a plurality of depressions in the first surface in the at least one squeegee area, each depression surrounded by a respective periphery having an elevation higher than an elevation of the first surface;
forming a through-hole through the mask film and the substrate in the at least one squeegee area; filling conductive paste into the through-hole by using a squeezing operation in the at least one squeegee area; and
cleaning a squeegee using the formed plurality of depressions during the squeezing operation.
2. A method for manufacturing a circuit board comprising:
attaching a mask film to a substrate in at least one squeegee area, the mask film including a first surface opposite a surface attached to the substrate;
forming a squeegee cleaning part at the first surface in the at least one squeegee area, the squeegee cleaning part having a plurality of depressions in the first surface, each depression surrounded by a respective periphery having an elevation higher than an elevation of the first surface;
forming a through-hole through the substrate and the mask film in the at least one squeegee area;
filling conductive paste into the through-hole by using a squeezing operation in the at least one squeegee area; and
cleaning a squeegee using the squeegee cleaning part during the squeezing operation,
wherein the squeegee cleaning part is formed at a predetermined position in the mask film before the filling of the conductive paste.
3. The method for manufacturing a circuit board of claim 1 ,
wherein the plurality of depressions are formed at a position which is not used to form a portion of the circuit board or an area outside of a product area of a paste-filling area of the mask film and within a printing range.
4. The method for manufacturing a circuit board of claim 1 ,
wherein each depression is a through-hole formed in the mask film.
5. The method for manufacturing a circuit board of claim 1 ,
wherein each depression is a linear groove formed at a paste-filling area of the mask film, the linear groove being formed so as not to penetrate through the substrate.
6. The method for manufacturing a circuit board of claim 5 ,
wherein the forming of each linear groove of the mask film includes processing the linear groove using a cutting edge.
7. The method for manufacturing a circuit board of claim 6 ,
wherein the cutting edge is a round blade.
8. The method for manufacturing a circuit board of claim 7 ,
wherein the round blade is fixed to a blade-fixing section having vertically sliding function with a certain load so as not to rotate.
9. The method for manufacturing a circuit board of claim 8 , further comprising setting a depth of the linear groove and the elevation of the perimeter portion of the plurality of depressions by adjusting an edge angle of the round blade and a load.
10. The method for manufacturing a circuit board of claim 1 ,
wherein the elevation of the perimeter portion of each depression is above the first surface by 3 μm or more.
11. The method for manufacturing a circuit board of claim 1 ,
wherein the substrate is a prepreg where resin material, whose main body is thermosetting resin, is impregnated into a fabric or a nonwoven fabric, thereby forming B-stage.
12. The method for manufacturing a circuit board of claim 11 ,
wherein aramid fabric is the main body of the fabric or the nonwoven fabric.
13. The method for manufacturing a circuit board of claim 11 ,
wherein glass fiber is the main body of the fabric or the nonwoven fabric.
14. The method for manufacturing a circuit board of claim 1 , wherein:
the filling of the conductive paste into the through-hole by using the squeezing operation comprises:
filling the conductive paste into the through-hole by reciprocating the squeegee on the circuit board; and
the cleaning of the squeegee using the formed plurality of depressions during the squeezing operation includes cleaning an edge of the squeegee by using the plurality of depressions.
15. The method for manufacturing a circuit board of claim 2 ,
wherein the predetermined position is a position which is not used to form a portion of the circuit board or an area outside of a product area of a paste-filling area of the mask film and within a printing range.
16. The method for manufacturing a circuit board of claim 2 ,
wherein the squeegee cleaning part is a linear groove formed at a paste-filling area of the mask film, the linear groove being formed so as not to penetrate through the substrate.
17. The method for manufacturing a circuit board of claim 16 ,
wherein the squeegee cleaning part is a plurality of the linear grooves.
18. The method for manufacturing a circuit board of claim 16 ,
wherein the forming of the linear groove of the mask film includes processing the linear groove using a cutting edge.
19. The method for manufacturing a circuit board of claim 18 ,
wherein the cutting edge is a round blade.
20. The method for manufacturing a circuit board of claim 19 ,
wherein the round blade is fixed to a blade-fixing section having vertically sliding function with a certain load so as not to rotate.
21. The method for manufacturing a circuit board of claim 20 , further comprising setting a depth of the linear groove and the elevation of the perimeter portion of the squeegee cleaning part by adjusting an edge angle of the round blade and the load.
22. The method for manufacturing a circuit board of claim 2 ,
wherein the elevation of the perimeter portion is above the first surface by 3 μm or more.
23. The method for manufacturing a circuit board of claim 2 ,
wherein the substrate is a prepreg where resin material, whose main body is thermosetting resin, is impregnated into a fabric or a nonwoven fabric, thereby forming B-stage.
24. The method for manufacturing a circuit board of claim 23 ,
wherein aramid fabric is the main body of the fabric or the nonwoven fabric.
25. The method for manufacturing a circuit board of claim 23 ,
wherein glass fiber is the main body of the fabric or the nonwoven fabric.
26. The method for manufacturing a circuit board of claim 2 ,
wherein the filling of the conductive paste into the through-hole by using the squeezing operation comprises:
filling the conductive paste into the through-hole by reciprocating the squeegee on the circuit board; and
the cleaning of the squeegee includes cleaning an edge of the squeegee by using the squeegee cleaning part.