Method for producing a chip panel by means of a heating and pressing process using a thermoplastic material

1 - 5 . (canceled)

6 . A method for producing a chip panel comprising:

loading a deformable chip carrier sheet on an upper side with semiconductor chips

having an upper contact side;

providing a transfer sheet; and

pressing the deformable chip carrier sheet and the transfer sheet together, including pressing the semiconductor chips into the deformable chip carrier sheet until the upper side of the deformable chip carrier is substantially level with the upper contact side of the semiconductor chips.

7 . The method of claim 6 , comprising:

removing the transfer sheet.

8 . The method of claim 6 , comprising:

heating the deformable chip carrier sheet.

9 . The method of claim 6 , comprising:

defining the chip carrier sheet to include a thermoplastic material; and

defining the transfer sheet to be made of a dimensionally stable thermosetting material.

10 . The method of claim 9 , comprising:

defining a transition temperature of the thermoplastic material to be below a decomposition temperature of the thermosetting material.

11 . The method of claim 6 , comprising:

arranging the semiconductor chips on the deformable chip carrier sheet in rows and columns.

12 . A method for producing a chip panel comprising:

loading a deformable chip carrier sheet on an upper side with semiconductor chips having an upper contact side;

loading a transfer sheet with transfer stamps having stamping surfaces;

pressing the deformable chip carrier sheet and the transfer sheet together, including pressing the semiconductor chips into the deformable chip carrier sheet until the upper side of the deformable chip carrier is substantially level with the upper contact side of the semiconductor chips.

13 . The method of claim 11 , comprising:

aligning the stamping surfaces congruent to the semiconductor chips on the deformable chip carrier sheet.

14 . A method for producing a chip panel comprising:

loading a chip carrier sheet on an upper side with semiconductor chips having an upper contact side facing an upper side of the chip carrier sheet;

providing a deformable transfer sheet; and

pressing the chip carrier sheet and the deformable transfer sheet together, including pressing the semiconductor chips into the deformable transfer sheet until the upper contact side of the semiconductor chips is substantially level with a surface if the deformable transfer sheet; and

removing the chip carrier sheet.

15 . The method of claim 14 , comprising:

heating the deformable transfer sheet.

16 . The method of claim 14 , comprising:

defining the deformable transfer sheet to include a thermoplastic material; and

defining the chip carrier sheet to be made of a dimensionally stable thermosetting material.

17 . The method of claim 16 , comprising:

defining a transition temperature of the thermoplastic material to be below a decomposition temperature of the thermosetting material; and

heating the thermoplastic material to a temperature of the transition temperature.

18 . The method of claim 14 , comprising:

arranging the semiconductor chips on the deformable chip carrier sheet in rows and columns.

19 . A method for producing a chip panel comprising:

loading a deformable chip carrier sheet on an upper side with semiconductor chips having an upper contact side;

providing a transfer sheet;

pressing the deformable chip carrier sheet and the transfer sheet together, including pressing the semiconductor chips into the deformable chip carrier sheet until the upper side of the deformable chip carrier is substantially level with the upper contact side of the semiconductor chips;

removing the transfer sheet; and

applying a redistribution routing pattern to the upper side of the chip carrier sheet.

20 . The method of claim 19 , comprising:

providing the redistribution routing pattern with external contact areas.

21 . The method of claim 19 , comprising:

defining the transfer sheet to be made of at least one of a group of materials consisting of a glass, a ceramic or a film.

22 . The method of claim 19 , comprising:

removing the transfer sheet using a etching process.

23 . The method of claim 19 , comprising:

removing the transfer sheet using a pulling process.

24 . The method of claim 19 , comprising:

removing the transfer sheet using a blasting process.

25 . The method of claim 19 , comprising:

removing the transfer sheet using a sputtering process.

26 . A device suitable for performing the method of claim 6 comprising:

means for pressing the deformable chip carrier sheet and the transfer sheet together; and

means for heating the deformable chip carrier sheet.

27 . The device of claim 26 , comprising:

wherein the device has a surface press, between the heatable pressing surfaces of which the transfer sheet and the chip carrier sheet can be precisely pressed onto each other until there is leveling of the upper sides of the semiconductor chips and deformable material of the transfer sheet or the chip carrier sheet.

28 . A semiconductor arrangement comprising:

a deformable chip carrier sheet loaded on an upper side with semiconductor chips having an upper contact side;

a transfer sheet loaded with transfer stamps having stamping surfaces; and

wherein the deformable chip carrier sheet and the transfer sheet are pressed together, including the semiconductor chips pressed into the deformable chip carrier sheet and the upper side of the deformable chip carrier is substantially level with the upper contact side of the semiconductor chips.