Thermoconductive silicone composition
View Patent ↗A thermoconductive silicone composition comprising: (A) an organopolysiloxane (excluding component (C)), (B) a thermoconductive filler, and (C) at least two organopolysiloxanes as defined by the following general formula that have different values for the subscript n (I), wherein each R 1 is independently selected from monovalent hydrocarbon groups; R 2 is an oxygen atom or divalent hydrocarbon group; R 3 is an alkyl, alkoxyalkyl, alkenyl, or acyl; n is an integer from 5 to 100; and a is an integer from 1 to 3
1. A composition comprising:
(A) an organopolysiloxane, wherein component (A) excludes component (C),
(B) a thermoconductive filler, and
(C) at least two organopolysiloxanes as defined by the following general formula that have different values for the subscript n
wherein each R 1 is independently selected from monovalent hydrocarbon groups; R 2 is an oxygen atom or divalent hydrocarbon group; R 3 is an alkyl, alkoxyalkyl, alkenyl, or acyl; n is an integer from 5 to 100; and a is an integer from 1 to 3; and
wherein the at least two organopolysiloxanes of component (C) have subscripts n in the general formula that differ by at least 10.
2. The composition of claim 1 , wherein component (B) has an average particle size of 0.1 to 100 μm.
3. The composition of claim 1 , wherein component (B) is an alumina powder.
4. The composition of claim 1 , wherein component (B) is a mixture comprising
(B 1 ) a spherical alumina powder with an average particle size of greater than 5 to 50 μm, and
(B 2 ) a spherical or irregularly shaped alumina powder with an average particle size of 0.1 to 5 μm.
5. The composition of claim 4 , wherein component (B) comprises 30 to 90 weight % of component (B 1 ) and 10 to 70 weight % of component (B 2 ).
6. The composition of claim 1 , wherein the content of component (B) is 500 to 2,500 parts by weight per 100 parts by weight of component (A).
7. The composition of claim 1 wherein the weight ratio in component (C) of the organopolysiloxane with the larger value of n in the formula to the organopolysiloxane with the smaller value of n is 1:10 to 10:1.
8. The composition of claim 1 , wherein the content of component (C) is 0.1 to 10 parts by weight per 100 parts by weight of component (B).
9. The composition of claim 1 , wherein the surface of component (B) is surface treated with component (C).
10. The composition of claim 1 , wherein the composition further comprises (D) a curing agent, and the composition is curable.
11. The composition of claim 10 , wherein the composition is cured by a hydrosilylation reaction, condensation reaction, or organoperoxide-induced free radical reaction.
12. The composition of claim 10 , wherein the composition is cured by a hydrosilylation reaction.
13. The composition of claim 10 , wherein the composition cures to form a thermoconductive silicone gel or a thermoconductive silicone rubber.