Thermal interconnect systems methods of production and uses thereof
View Patent ↗Layered interface materials described herein include at least one pulse-plated thermally conductive material, such as an interconnect material, and at least one heat spreader component coupled to the at least one pulse-plated thermally conductive material. A plated layered interface material having a migration component is also described herein and includes at least one pulse-plated thermally conductive material; and at least one heat spreader component, wherein the migration component of the plated layered interface material is reduced by at least 51% as compared to the migration component of a reference layered interface material. Another layered interface material described herein includes: a) a thermal conductor; b) a protective layer; c) a layer of material accept solder and prevent the formation of oxides; and d) a layer of solder material. Methods of forming layered interface materials are described herein that include: a) providing a pulse-plated thermally conductive interface material; b) providing a heat spreader component; and c) physically coupling the thermally conductive interface material and the heat spreader component. At least one additional layer, including a substrate layer, a surface, adhesive, a compliant fibrous component or any other suitable layer or a thermal interface material, can be coupled to the layered interface material.
1. A plated layered interface material having a migration component, comprising:
at least one pulse-plated thermally conductive material; and
at least one heat spreader component, wherein the migration component of the plated layered interface material is reduced by at least 51% as compared to the migration component of a reference layered interface material.
2. The plated layered interface material of claim 1 , wherein the migration component of the plated layered interface material is reduced by at least 60%.
3. The plated layered interface material of claim 2 , wherein the migration component of the plated layered interface material is reduced by at least 75%.
4. The plated layered interface material of claim 3 , wherein the migration component of the plated layered interface material is reduced by at least 90%.
5. The plated layered interface material of claim 4 , wherein the migration component of the plated layered interface material is reduced by at least 95%.
6. The plated layered interface material of claim 1 , wherein the pulse-plated thermally conductive material comprises a metal-based material.
7. The plated layered interface material of claim 6 , wherein the metal-based material comprises a transition metal.
8. The plated layered interface material of claim 7 , wherein the transition metal comprises gold.
9. The plated layered interface material of claim 1 , wherein the pulse-plated thermally conductive material is essentially non-porous.
10. The plated layered interface material of claim 1 , wherein the heat spreader component comprises a metal-based base material.
11. The plated layered interface material of claim 10 , wherein the metal-based base material comprises nickel, aluminum, copper or a combination thereof.
12. The plated layered interface material of claim 1 , wherein the heat spreader component comprises silicon, carbon or a combination thereof.
13. The plated layered interface material of claim 1 , wherein the layered material comprises at least one additional layer of material.
14. The plated layered interface material of claim 1 , wherein the pulse-plated thermally conductive material is less than about 1 μm thick.
15. The plated layered interface material of claim 14 , wherein the pulse-plated thermally conductive material is less than about 500 nm thick.
16. The plated layered interface material of claim 15 , wherein the pulse-plated thermally conductive material is less than about 100 nm thick.
17. The plated layered interface material of claim 16 , wherein the pulse-plated thermally conductive material is less than about 10 nm thick.
18. The plated layered interface material of claim 1 , wherein the pulse-plated thermally conductive material is laid down in a pattern.
19. The plated layered interface material of claim 1 , wherein the pulse-plated thermally conductive material is formed by a pulse plating apparatus.
20. The plated layered interface material of claim 1 , wherein the pulse-plated thermally conductive material is formed by a pulse periodic reverse method.
21. The plated layered interface material of one of claim 1 or 9 , further comprising a substrate.