Flat mobile antenna system
View Patent ↗An antenna system comprising a first multi-layer Printed Circuit Board having multiple antenna elements disposed thereon, at least a second multi-layer PCB, which is mounted below the first multi-layer PCB, and which comprises electronic components for processing Radio Frequency signals received by the antenna elements; and multiple RF transitions, which are mounted between the first and second multi-layer PCBs and are operative to transfer the RF signals from the first multi-layer PCB for processing by the electronic components in the second multi-layer PCB.
1. An antenna system, comprising:
a first multilayer Printed Circuit Board (PCB), having multiple antenna elements disposed thereon;
at least a second multilayer PCB, which is mounted below the first multilayer PCB, and which comprises electronic components for processing Radio Frequency (RF) signals received by the antenna elements; and
multiple RF transitions, which are mounted between the first and second multilayer PCBs and are operative to transfer the RF signals from the first multi-layer PCB for processing by the electronic components in the second multilayer PCB.
2. The system according to claim 1 , wherein the antenna elements are tilted with respect to a plane of the first multilayer PCB.
3. The system according to claim 1 , wherein the RF transitions comprise coaxial transitions.
4. The system according to claim 1 , wherein the antenna elements comprise microstrip elements that are disposed in respective recesses in a top surface of the first multilayer PCB.
5. The system according to claim 1 , wherein the electronic components comprise one or more phase shifters, one or more amplifiers and one or more combiners, which are respectively arranged to apply phase shifting, amplification and combining to the RF signals.
6. The system according to claim 5 , wherein the electronic components are arranged to electronically steer a beam pattern formed by the antenna elements in an elevation plane by applying the phase shifting, amplification and combining, and comprising a mechanical rotation subsystem, which is arranged to rotate the first and second multilayer PCBs in an azimuth plane.
7. The system according to claim 1 , wherein the second multilayer PCB has a top surface facing the first multilayer PCB, and wherein at least one of the electronic components is disposed on the top surface of the second multilayer PCB.