1-imidazolymethyl-substituted-2-naphtols and their use as accelerators for low-temperature curing
View Patent ↗Compounds of the general formulae (I) and (II): where R 1 , R 2 and R 3 each independently of one another are H; C 1-17 alkyl; C 3-12 cycloalkyl, optionally substituted by C 1-4 alkyl groups; C 4-20 cycloalkyl-alkyl, optionally substituted by C 1-4 alkyl groups; C 6-10 , aryl, optionally substituted by 1-3 C 1-4 alkyl groups, —CN, Hal, OH, or C 1-10 alkoxy; C 7-15 phenylalkyl, optionally substituted by 1-3 C 1-4 alkyl groups; C 3-12 alkenyl; C 3-12 alkynyl; or aromatic or aliphatic C 3-12 acyl; R 4 , R 5 , R 6 , R 7 , R 8 , and R 9 each independently of one another are H; C 1-17 alkyl, C 3-12 cycloalkyl, optionally substituted by C 1-4 alkyl groups; C 4-20 cycloalkyl-alkyl, optionally substituted by C 1-4 alkyl groups; C 6-10 aryl, optionally substituted by 1-3 C 1-4 alkyl groups; C 7-15 phenylalkyl, optionally substituted by 1-3 C 1-4 alkyl groups; C 3-17 alkenyl; C 3-12 alkynyl; C 1-12 alkoxy; or OH; for formula (1) R is C 1-12 alkyl; C 3-12 cycloalkyl, optionally substituted by C 1-4 alkyl groups; C 4-20 cycloalkyl-alkyl; optionally substituted by C 1-4 alkyl groups; C 6-10 aryl, optionally substituted by 1-3 C 1-4 alkyl groups; C 7-15 phenylalkyl, optionally substituted by 1-3 C 1-4 alkyl groups; C 3-12 alkenyl; or C 3-12 alkynyl; and for formula (II) n=2-12; as accelerators in curable epoxy resin compositions which are used as a compression moulding compound, sinter powder, encapsulating system, or casting resin, or for producing prepregs and laminates having very good interlaminar shear strength values using the resin infusion method, wet layup method and injection methods, for producing components, especially components of large surface area.
1. A compound of general formula (I) or (II):
where
R 1 , R 2 , and R 3 each independently of one another are H; C 1-7 alkyl; C 3-12 cycloalkyl, optionally substituted by C 1-4 alkyl groups; C 4-20 cycloalkyl-alkyl, optionally substituted by C 1-4 alkyl groups; C 6-10 aryl, optionally substituted by 1-3 C 1-4 alkyl groups, —CN, HaI, OH, or C 1-10 alkoxy; C 7-15 phenylalkyl, optionally substituted by 1-3 C 1-4 alkyl groups; C 3-12 alkenyl; C 3-12 alkynyl; or aromatic or aliphatic C 3-12 acyl;
R 4 , R 5 , R 6 , R 7 , R 8 and R 9 each independently of one another are H; C 1-17 alkyl; C 3-12 cycloalkyl, optionally substituted by C 1-4 alkyl groups; C 4-20 cycloalkyl-alkyl, optionally substituted by C 1-4 alkyl groups; C 6-10 aryl, optionally substituted by 1-3 C 1-4 alkyl groups; C 7-15 phenylalkyl, optionally substituted by 1-3 C 1-4 alkyl groups; C 3-17 alkenyl; C 3-12 alkynyl; C 1-12 alkoxy or OH;
for formula (I) R is C 1-12 alkyl or C 3-12 alkenyl;
and for formula (II) n=2-12.
2. A compound according to claim 1 , where R 1 , R 2 and R 3 each independently of one another are H; C 1-17 alkyl; phenyl; or C 7-15 phenylalkyl, optionally substituted by 1-3 C 1-4 alkyl groups.
3. A compound according to claim 2 , where R 2 and R 3 each H; and
R 1 is C 1-17 alkyl; phenyl; or C 7-15 phenylalkyl, optionally substituted by 1-3 C 1-4 alkyl groups.
4. A compound according to claim 1 , where Formula (II) n=6-12.
5. A compound according to claim 1 , where R 4 , R 5 , R 6 , R 7 , R 8 and R 9 are H.
6. A compound according to claim 1 , where R 1 is methyl;
R 2 , R 3 , R 4 , R 5 , R 6 , R 7 , R 8 and R 9 are H;
R is n-butyl, n-nonyl, n-dodecyl, or allyl; and
n=8.
7. A curable composition comprising:
a) an epoxy resin whose epoxide content is from 0.1 to 11 epoxide equivalents/kg;
b) from 1 to 10 parts by weight, based on the total weight of the curable composition, of a compound of formula (I) or (II):
where
R 1 , R 2 , and R 3 each independently of one another are H; C 1-17 alkyl; C 3-12 cycloalkyl, optionally substituted by C 1-4 alkyl groups; C 4-20 cycloalkyl-alkyl, optionally substituted by C 1-4 alkyl groups; C 6-10 aryl, optionally substituted by 1-3 C 1-4 alkyl groups, —CN, HaI, OH, or C 1-10 alkoxy; C 7-15 phenylalkyl, optionally substituted by 1-3 C 1-4 alkyl groups; C 3-12 alkenyl; C 3-12 alkynyl; or aromatic or aliphatic C 3-12 acyl; R 4 , R 5 , R 6 , R 7 , R 8 and R 9 each independently of one another are H; C 1-17 alkyl; C 3-12 cycloalkyl, optionally substituted by C 1-4 alkyl groups; C 4-20 cycloalkyl-alkyl, optionally substituted by C 1-4 alkyl groups; C 6-10 aryl, optionally substituted by 1-3 C 1-4 alkyl groups; C 7-15 phenylalkyl, optionally substituted by 1-3 C 1-4 alkyl groups; C 3-17 alkenyl; C 3-12 alkynyl; C 1-2 alkoxy or OH;
for formula (I) R is C 1-12 alkyl; C 3-12 cycloalkyl, optionally substituted by C 1-4 alkyl groups; C 4-20 cycloalkyl-alkyl, optionally substituted by C 1-4 alkyl groups; C 6-10 aryl, optionally substituted by 1-3 C 1-4 alkyl groups; C 7-15 phenylalkyl, optionally substituted by 1-3 C 1-4 alkyl groups; C 3-12 alkenyl or C 3-12 alkynyl; and for formula (II) n=2-12;
c) a curing agent for the epoxy resin having from 0.5 to 1.5 functional groups per epoxide group; and optionally
d) one or more additives.
8. A curable composition according to claim 7 , wherein the curing agent is an amine or polyamine.
9. A curable composition according to claim 8 , wherein the curing agent is a polyoxypropylenediamine.
10. A curable composition according to claim 7 , wherein the epoxy resin is a glycidyl ether, glycidyl ester, N-glycidyl or N,O-glycidyl derivative of an aromatic or heterocyclic compound, or a cycloaliphatic glycidyl compound.
11. A prepreg comprising a curable composition according to claim 7 .
12. A method for making a curable composition comprising adding to an epoxy resin a curing agent and a compound of formula (I) or (II):
where R 1 , R 2 , and R 3 each independently of one another are H; C 1-17 alkyl; C 3-12 cycloalkyl, optionally substituted by C 1-4 alkyl groups; C 4-20 cycloalkyl-alkyl, optionally substituted by C 1-4 alkyl groups; C 6-10 aryl, optionally substituted by 1-3 C 1-4 alkyl groups, —CN, HaI, OH, or C 1-10 alkoxy; C 7-15 phenylalkyl, optionally substituted by 1-3 C 1-4 alkyl groups; C 3-12 alkynyl; C 3 alkynyl; or aromatic or aliphatic C 3-12 acyl;
R 4 , R 5 , R 6 , R 7 , R 8 and R 9 each independently of one another are H; C 1-17 alkyl; C 3-12 cycloalkyl, optionally substituted by C 1-4 alkyl groups; C 4-20 cycloalkyl-alkyl, optionally substituted by C 1-4 alkyl groups; C 6-10 aryl, optionally substituted by 1-3 C 1-4 alkyl groups; C 7-15 phenylalkyl, optionally substituted by 1-3 C 1-4 alkyl groups; C 3-17 alkenyl; C 3-12 alkynyl; C 1-12 alkoxy or OH;
for formula (I) R is C 1-12 alkyl; C 3-12 cycloalkyl, optionally substituted by C 1-4 alkyl groups; C 4-20 cycloalkyl-alkyl, optionally substituted by C 1-4 alkyl groups; C 6-10 aryl, optionally substituted by 1-3 C 1-4 alkyl groups; C 7-15 phenylalkyl, optionally substituted by 1-3 C 1-4 alkyl groups; C 3-12 alkenyl or C 3-12 alkynyl; and for formula (II) n=2-12.
13. The method of claim 12 wherein the compound of formula (I) or (II) is dissolved beforehand in the curing agent at a temperature between 60°-80° C.