Method for mounting an electronic component on a substrate
This invention proposes a manufacturing process for a transponder in the form of a card or a label able to resist to flexions or twisting without interrupting the connections of the electronic components. The process of assembling at least one electronic component including sensibly flat conductive areas that are connected to conductive tracks placed on the surface of a generally flat substrate comprises the steps of placing the substrate on a work surface, the face including conductive tracks being oriented upwards, placing the electronic component into a cavity of the substrate situated in a zone including the conductive tracks, the conductive areas of the component coming into contact with the corresponding tracks of the substrate and applying a layer of insulating material which extends at once on the electronic component and at least on a substrate zone surrounding said component. This process implies that the contact between the conductive areas of the electronic component and the conductive tracks of the substrate realizes an electric connection ensured by the pressure of application of the insulating material layer on the electronic component.
1. A process for assembling a flexible transponder including at least one electronic component made up of a chip provided with contacts on one of the faces of the chip, said contacts being set off on a conductive film constituting flat conductive areas that extend the contacts of the chip in a plane over the chip, the conductive areas being connected to conductive tracks placed on a surface of a planar insulating substrate, comprising:
placing the substrate on a work surface, the face including conductive tracks being oriented upwards,
placing the electronic component into a cavity of the substrate situated in a zone including the conductive tracks, the chip being inserted into the cavity, the conductive areas of the electronic component coming into contact with the corresponding conductive tracks of the substrate, and
forming a layer of insulating material which extends concurrently on the electronic component and at least on the zone of the substrate surrounding said electronic component,
wherein the conductive areas of the electronic component and the conductive tracks of the substrate are in contact to achieve a permanent electric connection via a pressure of application of the insulating material layer on the electronic component, and after forming the layer of insulating material, the contacted conductive areas of the electronic component and the conductive tracks of the substrate are configured to rub together when repeated stressed are exerted on the substrate.
2. The process according to claim 1 , wherein the electronic component is coated by an insulating material on the face of the chip opposite to the face provided with contacts.
3. The process according to claim 1 , wherein the cavity is obtained by heating the chip of the electronic component, then pressing said chip into the substrate material so that the conductive areas of said electronic component are applied against the surface of the substrate.
4. The process according to claim 1 wherein the cavity is formed by milling or by stamping a window.
5. A process for assembling a flexible transponder including at least one electronic component made up of a chip provided with contacts on one of the faces of the chip, said contacts being set off on a conductive film constituting fiat conductive areas that extend the
contacts of the chip in a plane over the chip, comprising: placing a first substrate on a work surface, placing the chip of the electronic component into a cavity of the first substrate, the conductive areas of the electronic component being applied against the surface of the first substrate, and
assembling the first substrate provided with the electronic component on a second substrate provided with conductive tracks, so that the conductive areas of the electronic component applied against the surface of the first substrate connect to the conductive tracks of the second substrate, wherein the conductive areas of the electronic component and the conductive tracks of the second substrate are in contact to achieve a permanent electric connection via a pressure of application of the second substrate on the electronic component, and after the assembling, the conductive areas of the electronic component and the conductive tracks of the second substrate are configured to rub together when repeated stresses are exerted on the substrates.
6. The process according to claim 5 , wherein the electronic component is coated by an insulating material on the face of the chip opposite to the face provided with contacts.
7. The process according to claim 5 , wherein the cavity is obtained by heating the chip of the electronic component then pressing said chip into the substrate material so that the conductive areas of said electronic component are applied against the surface of the substrate.
8. The process according to claim 1 , wherein the cavity is formed by milling or by stamping a window.
9. A process for assembling a flexible transponder including at least one electronic component made up of a module including a set of fiat contacts on one of the faces of the module, each contact of the set being linked with a contact area on the opposite face, comprising:
placing a first substrate on a work surface, placing the chip of the electronic component into a cavity provided with a window cut into a first substrate, the set of flat contacts shows on the surface level of said first substrate, and
assembling the first substrate provided with the electronic component on a second substrate provided with conductive tracks, so that the conductive areas of the opposite face of the electronic component connect to the conductive tracks of the second substrate, wherein the conductive areas of the electronic component and the conductive tracks of the second substrate are in contact to achieve a permanent electric connection via a pressure of application of the second substrate on the electronic component, and after the assembling, the conductive areas of the electronic component and the conductive tracks of the second substrate are configured to rub together when repeated stresses are exerted on the substrates.
10. The process according to claim 9 , wherein at least one module or a supplementary chip is mounted in one of the substrates, said module including conductive areas connected by pressure on the corresponding conductive tracks of either of the substrates.
11. The process according to claim 10 , further comprising a supplementary step of gluing and pressing the assembly formed by the superposition of the substrates.
12. The process according to claim 1 , wherein the conductive areas of the electronic component and the conductive tracks of the substrate are in direct contact to obtain the permanent electric connection.
13. The process according to claim 1 , wherein the conductive areas of the electronic component and the conductive tracks of the substrate are in constant contact to obtain the permanent electric connection.
14. The process according to claim 1 , wherein the layer of insulating material extends concurrently over the electronic component and the zone of the substrate surrounding the electronic component.