Compact via transmission line for printed circuit board and its designing method
View Patent ↗A compact via transmission line for a printed circuit board having preferred characteristic impedance and capable of miniaturizing the printed circuit board including a multilayer printed circuit board, and extending the frequency range of a via transmission line mounted on the printed circuit board, and a design method of the same. The transmission line has a central conductor forming an inner conductor layer boundary make up a signal via hole, a plurality of via holes arranged around the central conductor form an outer conductor layer boundary, and a plurality of conductor plates formed of a printed circuit board conductor layer, is further provided with a constitutive parameter adjustment clearance hole between the inner and outer conductor layer boundaries of the compact via transmission line, and electrically isolates to prevent cross-talk of a signal propagating through a signal via hole with other signals in a high-frequency signal band.
1. A compact via transmission line for a printed circuit board provided on the printed circuit board, wherein said compact via transmission line comprises:
a central conductor which forms an inner conductor boundary of said compact via transmission line, and through which a signal transmits;
a plurality of ground via holes which form an outer conductor boundary of said compact via transmission line;
a ground plate formed of a conductor layer of said printed circuit board connected to said ground via holes; and
a constitutive parameter adjustment via hole provided between said inner conductor boundary and said outer conductor boundary to adjust a constitutive parameter of said printed circuit board, and
wherein said constitutive parameter adjustment via hole is filled with a uniform medium or a composite medium having a second constitutive parameter different from a first constitutive parameter of an insulating layer comprising said printed circuit board.
2. The compact via transmission line for the printed circuit board according to claim 1 ,
wherein said printed circuit board is a multilayer printed circuit board having a plurality of conductor layers.
3. The compact via transmission line for the printed circuit board according to claim 1 ,
wherein said compact via transmission line is impedance-matched to an interconnected circuit mounted on said printed circuit board, and connected to said compact via transmission line.
4. The compact via transmission line for the printed circuit board according to claim 1 ,
wherein said ground via holes are arranged on a circumference.
5. The compact via transmission line for the printed circuit board according to claim 1 ,
wherein said ground via holes are arranged in a square.
6. The compact via transmission line for the printed circuit board according to claim 1 ,
wherein said first and second constitutive parameters are at least any one of relative permittivity and relative permeability.
7. The compact via transmission line for the printed circuit board according to claim 6 ,
wherein a value of said second constitutive parameter is smaller than a value of said first constitutive parameter.
8. A compact via transmission line for a printed circuit board provided on the printed circuit board, wherein said compact via transmission line comprises:
two central conductors which form two inner conductor boundaries of said compact via transmission line, and through which differential signals transmit; a plurality of ground via holes which form two outer conductor boundaries each arranged around said two central conductors;
ground plates formed of conductor layers of said printed circuit board connected to said ground via holes; and
two constitutive parameter adjustment via holes provided between said two inner conductor boundaries and said two outer conductor boundaries to adjust constitutive parameters of said printed circuit board, and
wherein said two constitutive parameter adjustment via holes are each filled with a uniform medium or a composite medium having a second constitutive parameter different from a first constitutive parameter of an insulating layer comprising said printed circuit board.
9. A design method of a compact via transmission line for a printed circuit board comprising a central conductor which forms an inner conductor boundary of the compact via transmission line for the printed circuit board provided on the printed circuit board, and through which a signal transmits, a plurality of ground via holes which form an outer conductor boundary of said compact via transmission line, and a ground plate formed of a conductor layer of said printed circuit board connected to the ground via holes,
wherein a constitutive parameter adjustment via hole for adjusting a constitutive parameter of said printed circuit board is provided between said inner conductor boundary and said outer conductor boundary, said constitutive parameter adjustment via hole being filled with a uniform medium or a composite medium having a second constitutive parameter different from a first constitutive parameter of an insulating layer comprising said printed circuit board.
10. The design method of the compact via transmission line for the printed circuit board according to claim 9 ,
wherein a value of relative permittivity of said second constitutive parameters is smaller than a value of relative permittivity of said first constitutive parameters.
11. The design method of the compact via transmission line for the printed circuit board according to claim 9 ,
wherein said first and second constitutive parameters are at least any one of relative permittivity and relative permeability.
12. The design method of the compact via transmission line for the printed circuit board according to claim 9 ,
wherein said compact via transmission line is impedance-matched to an interconnected circuit mounted on said printed circuit board and connected to said compact via transmission line.