Rectifying diodes with self-aligned electrodes
View Patent ↗A rectifying diode comprising a semiconducting layer, a first electrode, and a second electrode, wherein the width of the region of closest contact between the two electrodes is on the order of the thickness of the semiconducting layer.
1. A method for fabricating a rectifying diode of a device including an active semiconducting layer between two electrodes, wherein the electrodes are formed by a method, comprising:
forming a first electrode of a first conductive material in a first region of a substrate, depositing a liquid comprising a second conductive material to come in contact with the first electrode and to form a second electrode of the second conductive material in a second region of the substrate spaced from the first region,
preparing the surface of the first electrode prior to the deposition of the liquid comprising the second material to repel the liquid,
wherein the shortest distance between the first electrode and the second electrode defines the thickness of the active semiconducting layer of the rectifying diode.
2. A method as claimed in claim 1 , wherein the method comprises the additional step of depositing at least one semiconducting layer in the region between the first and second electrodes.
3. A method as claimed in claim 1 , wherein the first electrode is also deposited from a liquid.
4. A method as claimed in claim 1 , wherein the composition of the liquid from which the first electrode is deposited has a tendency to segregate to form a surface region over the first conductive material, the surface region having a different composition from the first conductive material.
5. A method as claimed in claim 4 , wherein said surface region is semiconducting, and forms at least part of the active semiconductor layer of the rectifying diode.
6. A method as claimed in claim 1 , wherein the first and second materials are essentially the same.
7. A method as claimed in claim 1 , wherein the liquid from which the first electrode is deposited is a solution of at least two components having a tendency to segregate.
8. A method as claimed in claim 7 , wherein one of the components is a polymer with a tendency to segregate to the surface of the first composition.
9. A method as claimed in claim 7 , wherein one of the components is a diblock copolymer comprising a relatively polar and a relatively non-polar block.
10. A method as claimed in claim 7 , wherein one of the components is a surfactant.
11. A method as claimed in claim 1 , comprising treating the first electrode prior to deposition of the liquid of the second composition so as to modify at least one physical or chemical property of the surface of the first electrode, thereby forming a surface region over the first conductive material.
12. A method as claimed in claim 11 , wherein the step of modifying the surface of the first electrode comprises exposing the substrate to a plasma.
13. A method as claimed in claim 12 , wherein said plasma contains fluorinated species.
14. A method as claimed in claim 1 , wherein the surface of the first and second electrodes exhibit different workfunctions.
15. A method as claimed in claim 14 , wherein the difference in work function between the first and second electrodes is generated by the step of preparing the surface of the first electrode prior to the deposition of the liquid comprising the second material.
16. A method as claimed in claim 14 , wherein the surface of the first and/or second electrodes are treated after being deposited to modify the workfunction of at least one of the first and second electrodes.
17. A method as claimed in claim 16 , where in the conductive material of the first electrode has a different workfunction than the conductive material of the second electrode.
18. A method as claimed in claim 1 , wherein the material of at least one of the first or second electrodes is a printable metal.