Method of manufacturing a gallium nitride semiconductor light emitting device
View Patent ↗The present invention relates to a nitride semiconductor light emitting device including a plurality of nitride semi-conductor layers with a p-type nitride semiconductor formed using as nitrogen precursor ammonia together with hydrazine-based material which upon thermal decomposition generates a radical being combined with a hydrogen radical to eliminate the hydrogen radical, thereby eliminates the need for a subsequent annealing process for removing hydrogen and prevents the active layer from being thermally damaged due to the subsequent annealing process.
1. A method of manufacturing a nitride semiconductor light emitting device, the nitride semiconductor light emitting device including a plurality of nitride semiconductor layers and an electrode layer disposed on the plurality of the nitride semiconductor layers, the plurality of nitride semiconductor layers having an active layer that generates light through recombination of electrons and holes, and a p-type nitride semiconductor layer for supplying holes to the active layer, the method comprising the steps of:
forming the p-type nitride semiconductor layer of the plurality of nitride semiconductor layers, without a subsequent annealing process, by using ammonia and hydrazine-based material as nitrogen precursor wherein the p-type nitride semiconductor layer contains gallium, and the molar flow ratio of hydrazine-based material/gallium in 1 to 10 and, upon thermal decomposition, the hydrazine-based material generates a radical that is combined with a hydrogen radical to eliminate the hydrogen radical to make the p-type nitride semiconductor layer without the subsequent annealing process during the formation of the p-type nitride semiconductor layer; and
forming the electrode layer to be electrically in contact with the p-type nitride semiconductor layer.
2. The method of claim 1 , wherein the electrode layer is made of at least one selected from the group consisting of nickel, gold, silver, chrome, titanium, platinum, palladium, rhodium, iridium, aluminum, tin, ITO, indium, tantalum, copper, cobalt, iron, ruthenium, zirconium, tungsten, lanthanum and molybdenum.
3. The method of claim 2 , wherein the molar flow ratio of hydrazine-based material/gallium is 1 to 500.
4. The method of claim 3 , wherein the electrode layer is made of ITO (Indium Tin Oxide).
5. The method of claim 3 , wherein the p-type nitride semiconductor layer is doped with magnesium (Mg) and the p-type nitride semiconductor layer is made of GaN.
6. The method of claim 5 , wherein the molar flow ratio of ammonia/gallium is below 5000, and N 2 and H 2 are used as carrier gas.
7. The method of claim 6 , wherein a radical of the hydrazine-based material contains at least one of CH 3 and NH 2 .