Resin composition for printed wiring board, prepreg, laminate, and printed wiring board made with the same
View Patent ↗An epoxy resin composition for printed wiring boards which comprises an epoxy resin, a phenolic novolak, a curing accelerator, and a silica filler, characterized in that the silica filler has a shape having at least two planes and has an average particle diameter of 0.3 to 10 μm and a specific surface area of 8 to 30 m 2 /g. The epoxy resin composition has a higher apparent viscosity than the resins and can hence be inhibited from sagging in a drying oven. This composition retains the intact property of infiltration into reinforcements because the viscosity of the resins themselves has not increased locally. The composition hence produces the effect of improving the appearance of a prepreg.
1. A process for producing a printed wiring board, which comprises: gluing a prepreg to a metal foil surface and hot pressing the prepreg and the metal foil surface to produce a laminate board, and forming a circuit on an outer layer of the laminate board to yield a printed wiring board; wherein said prepreg is manufactured by impregnating a reinforcing material with an epoxy resin composition followed by drying and semi-curing the composition to B-stage; said epoxy resin composition comprising an epoxy resin, a phenol novolac resin, a curing accelerator and a silica filler; wherein said silica filler is a silica filler which has a shape having at least two planes, and has an average particle diameter between 0.3 pin and 10 μm and a relative surface area between 8 m 2 /g and 30 m 2 /g.
2. A process for producing a printed wiring board as described in claim 1 , wherein said silica filler is a silica filler having at least two planes in the shape, an average particle diameter between 0.3 μm and 10 μm and a relative surface area between 10 m 2 /g and 20 m 2 /g.
3. A process for producing a printed wiring board as described in claim 1 , wherein said silica filler is added in an amount of from 3% to 80% by weight per the solid content of the resin.
4. A process for producing a printed wiring board as described in claim 1 , wherein said silica filler is a silica filler having an electric conductivity of 15 μs or less.
5. A process for producing a printed wiring board as described in claim 1 , wherein said silica filler is a silica filler which has been vitrified through melting at a temperature of 1800° C or higher.
6. A process for producing a printed wiring board as described in claim 1 , wherein said epoxy resin is an epoxy resin having a bromine content of between 5% and 20% by weight per the solid content of the resin without silica filler and containing an epoxy resin obtained by reacting a dihydric phenol with a bisphenol A type epoxy resin in an amount of between 40% and 100% by weight based on the whole amount of the epoxy resin solid content.
7. A process for producing a printed wiring board as described in claim 1 , wherein said epoxy resin is an epoxy resin having a bromine content of between 5% and 20% by weight per the solid content of the resin without silica filler and containing an epoxy resin possessing a dicyclopentadienyl structure in an amount of between 40% and 100% by weight based on the whole amount of the epoxy resin solid content.
8. A process for producing a printed wiring board as described in claim 1 , wherein said epoxy resin is an epoxy resin having a bromine content of between 5% and 20% by weight per the solid content of the resin without silica filler and containing of a novolac type epoxy resin in an amount of between 40% and 100% by weight based on the whole amount of the epoxy resin solid content.
9. A process for producing a printed wiring board as described in claim 1 , wherein said epoxy resin composition is a bromine-free epoxy resin composition.
10. A process for producing a printed wiring board, which comprises:
coupling a prepreg to a metal foil surface to produce a laminate board, and forming a circuit on an outer layer of the laminate board to yield a printed wiring board; wherein said prepreg is obtained by impregnating a reinforcing material with an epoxy resin composition for a printed wiring board and drying said composition to B-stage; said epoxy resin composition comprising an epoxy resin, a phenol novolac resin, a curing accelerator, and a silica filler which has a shape having at least two planes and has an average particle diameter between 0.3 μm and 10 μm and a relative surface area between 8 m 2 /g and 30 m 2 /g.
11. A printed wiring board, which is formed from a laminated board;
wherein said laminate board is obtained by coupling a prepreg to a metal foil surface to produce a laminate board, and forming a circuit on an outer layer of the laminate board to yield a printed wiring board; wherein said prepreg is obtained by impregnating a reinforcing material with an epoxy resin composition for a printed wiring board and drying said composition to B-stage; said epoxy resin composition comprising an epoxy resin, a phenol novolac resin, a curing accelerator, and a silica filler which has a shape having at least two planes and has an average particle diameter between 0.3 μm and 10 μm and a relative surface area between 8 m 2 /g and 30 m 2 /g.