Thermally and electrically conductive apparatus
View Patent ↗The present invention provides a thermally and electrically conductive apparatus that can provide both thermal conductivity and electrical conductivity for one or more electronic devices connected thereto. The apparatus comprises a thermally conductive element that is in thermal contact with one or more electronic devices and optionally in contact with a heat dissipation system. A portion of the thermally conductive element is surrounded by a multilayer coating system comprising two or more layers. The multilayer coating system includes alternating electrically insulating and electrically conductive layers in order to provide paths for the supply of electric current to the one or more electronic devices. A conductive layer of the multilayer coating system may be selectively patterned to connect to one or more electronic devices. In this manner, the combination of an electronic circuit carrier and a thermally conductive element can unify thermal conductivity with the provision of power and/or communication into a single integrated unit for use with electronic devices.
1. A thermally and electrically conductive apparatus, the apparatus comprising:
a) a thermally conductive element comprising a first end portion and a second end portion opposite the first end portion, wherein the first end portion of the thermally conductive element is in thermal contact with one or more electronic devices, and wherein the second end portion is embedded within a support structure; and
b) a multilayer coating system comprising three or more layers, said three or more layers being a sequence of electrically insulating and electrically conductive layers, said electrically conductive layers providing one or more paths for supplying electric current to the one or more electronic devices;
wherein the three or more layers are integrally formed on, and surround, a portion of the thermally conductive element, and extend from the first end portion toward the second end portion.
2. The thermally and electrically conductive apparatus according to claim 1 , wherein one or more of the layers of the multilayer coating system include circuit traces for connection of the one or more electronic devices thereto, thereby providing a means for controlling the one or more electronic devices individually or in one or more groups of electronic devices.
3. The thermally and electrically conductive apparatus according to claim 1 , wherein the thermally conductive element is electrically conductive, comprising a path for supplying electric current to the one or more electronic devices.
4. The thermally and electrically conductive apparatus according to claim 1 , wherein one or more of the three or more layers of the multilayer coating system are formed by deposition.
5. The thermally and electrically conductive apparatus according to claim 1 , wherein the support structure comprises a circuit carrier.
6. The thermally and electrically conductive apparatus according to claim 5 , wherein the multilayer coating system matingly connects with the circuit carrier and comprises one or more electrical connections between the support structure and the thermally and electrically conductive apparatus.
7. The thermally and electrically conductive apparatus according to claim 6 , wherein the thermally and electrically conductive apparatus is permanently connected to the support structure.
8. The thermally and electrically conductive apparatus according to claim 6 , wherein the thermally and electrically conductive apparatus is removably connected to the support structure.
9. The thermally and electrically conductive apparatus according to claim 5 , wherein the support structure includes a heat dissipation system.
10. The thermally and electrically conductive apparatus according to claim 1 , wherein the multilayer coating system sheaths at least a portion of the thermally conductive element.
11. The thermally and electrically conductive apparatus according to claim 1 , wherein the thermally conductive element is a passive thermal device selected from the group comprising heat pipe, thermosyphon, microchannel cooler and macrochannel cooler.
12. The thermally and electrically conductive apparatus according to claim 1 , wherein the thermally conductive element is an active thermal device selected from the group comprising thermoelectric cooler, thermionic cooler and forced convection cooler.
13. The thermally and electrically conductive apparatus according to claim 1 , wherein the thermally conductive element has a shape selected from the group comprising pin, planar element, curved element, cylinder, paraboloid and ellipsoid.
14. The thermally and electrically conductive apparatus according to claim 1 , wherein the thermally conductive element has a cross sectional shape selected from the group comprising circular, parabolic, elliptical, prismatic and rectangular.
15. The thermally and electrically conductive apparatus according to claim 1 , wherein the thermally conductive element has a curvilinear shape.