IP Library Granted Patent US 7,470,291
Granted Patent B2
US 7,470,291 · App. 10/567,436 · Granted Dec 30, 2008

Production process of ceramic electronic component

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Quick Facts
Patent No.
US 7,470,291
App. No.
10/567,436
Granted
Dec 30, 2008
Kind
B2
Abstract

At least one conductive layer is formed by applying paste mainly containing metal on at least one insulating sheet. At least one sintered body is provided by firing the at least one insulating sheet having the at least one conductive layer formed thereon. The amount of the metal contained in the at least one conductive layer of the at least one sintered body is detected. A sintered body is selected from the at least one sintered body based on the detected amount of the metal. An outer electrode is formed on the selected sintered body, thus providing a ceramic electronic device. This method allows a defective to be detected in an early stage of manufacturing processes, hence providing a ceramic electronic device to be manufactured efficiently.

Claims (29)

1. A method of manufacturing a ceramic electronic device, comprising:

forming at least one conductive layer by applying paste mainly containing metal on at least one insulating sheet;

providing at least one sintered body by firing the at least one insulating sheet having the at least one conductive layer formed thereon;

detecting an amount of the metal contained in the at least one conductive layer of the at least one sintered body;

selecting a sintered body from the at least one sintered body based on the detected amount of the metal; and

forming an outer electrode on the selected sintered body.

2. The method of claim 1 , wherein said detecting an amount of the metal contained in the at least one conductive layer of the at least one sintered body comprises:

causing the at least one sintered body to vibrate near a coil;

measuring a voltage induced on the coil; and

detecting the amount of the metal contained in the at least one conductive layer based on the measured inducted voltage.

3. The method of claim 1 , further comprising

forming at least one laminated body by using the at least one insulating sheet having the at least one conductive layer formed thereon,

wherein said providing at least one sintered body by firing the at least one insulating sheet having the at least one conductive layer formed thereon comprises providing the at least one sintered body by firing the at least one laminated body.

4. The method of claim 1 , wherein the metal comprises nickel.

5. The method of claim 1 , wherein the insulating sheet comprises a ceramic sheet.

6. The method of claim 1 , wherein the insulating sheet comprises a base film made from insulating material.

7. A method of manufacturing a ceramic electronic device, comprising:

forming at least one conductive layer by applying paste mainly containing metal on at least one insulating sheet;

providing at least one sintered body by firing the at least one insulating sheet having the at least one conductive layer formed thereon;

causing the at least one sintered body to vibrate near a coil;

measuring a voltage induced on the coil; and

selecting, based on the measured induced voltage, a sintered body from the at least one sintered body; and

forming an outer electrode on the selected sintered body.

8. The method of claim 7 , further comprising

forming at least one laminated body by using the at least one insulating sheet having the at least one conductive layer formed thereon,

wherein said providing the at least one sintered body by firing the at least one insulating sheet having the at least one conductive layer formed thereon comprises providing the at least one sintered body by firing the at least one laminated body.

9. The method of claim 7 , wherein the metal comprises nickel.

10. The method of claim 7 , wherein the insulating sheet comprises a ceramic sheet.

11. The method of claim 7 , wherein the insulating sheet comprises a base film made from insulating material.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 5, 2010
From: PANASONIC CORPORATION
To: MURATA MANUFACTURING CO., LTD.
Reel/Frame 023892/0939 →
CHANGE OF NAME Recorded Nov 24, 2008
From: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
To: PANASONIC CORPORATION
Reel/Frame 021897/0689 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 17, 2006
From: OTSUKI, JUN; NAGAI, ATSUO
To: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
Reel/Frame 018533/0148 →