IP Library Patent Application 10568927
Patent Application
App. No. 10/568,927

Led light source

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Quick Facts
Patent No.
US None
App. No.
10/568,927
Abstract

An LED unit ( 20 ) having increased light output. The LED unit ( 20 ) includes a submount substrate ( 22 ) having a cavity ( 24 ). An LED chip ( 30 ) is electrically mounted within the cavity ( 24 ) and a phosphor layer ( 34 ) is deposited in the cavity ( 24 ) that converts blue light from the LED chip ( 30 ) into white light suitable for a vehicle headlight ( 10 ). The walls of the cavity ( 24 ) are metalized ( 40 ) to increase the light output intensity. In one embodiment, a clear protective layer ( 46 ) is deposited in the cavity ( 24 ) over the phosphor layer ( 34 ).

Claims (32)

1 . An LED unit comprising:

a substrate including a cavity;

at least one LED chip mounted within the cavity; and

a phosphor layer deposited within the cavity and encapsulating the LED chip.

2 . The unit according to claim 1 wherein a top surface of the phosphor layer is substantially even with a top surface of the substrate.

3 . The unit according to claim 1 further comprising a clear layer deposited in the cavity on top of the phosphor layer.

4 . The unit according to claim 3 wherein a top surface of the clear layer is substantially even with a top surface of the substrate.

5 . The unit according to claim 3 wherein the clear layer is silicon.

6 . The unit according to claim 1 wherein walls of the cavity are metalized to provide an increased light reflection therefrom.

7 . The unit according to claim 1 wherein walls of the cavity are tapered.

8 . The unit according to claim 1 further comprising a base substrate that accommodates a plurality of LED units.

9 . The unit according to claim 1 wherein the at least one LED chip is a 1×1 mm square LED chip and the cavity is a 1.2×1.2 mm square cavity.

10 . The unit according to claim 1 wherein the at least one LED chip is two LED chips.

11 . The unit according to claim 10 wherein the two LED chips are square chips.

12 . The unit according to claim 11 wherein the LED chips are 1×1 mm square LED chips.

13 . The unit according to claim 1 wherein the LED unit is part of a vehicle headlight.

14 . A vehicle headlight comprising:

a base substrate a cavity; and

a plurality of LED units mounted to the base substrate in a predetermined pattern, each LED unit including a sub-mount substrate having a cavity, each LED unit including at least one LED chip mounted within the cavity and a phosphor layer deposited within the cavity and encapsulating the LED chip.

15 . The unit according to claim 14 wherein each LED unit further includes a clear layer deposited in the cavity on top of the phosphor layer.

16 . The unit according to claim 14 wherein walls of each cavity are metalized to provide an increased light reflection therefrom.

17 . The unit according to claim 14 wherein walls of each cavity are tapered.

18 . The unit according to claim 14 wherein the at least one LED chip is two LED chips.

19 . A method of making an LED unit, said method comprising:

providing a substrate;

forming a cavity in the substrate;

electrically mounting at least one LED chip within the cavity; and

depositing a phosphor layer within the cavity to encapsulate the LED chip.

20 . The method according to claim 19 further comprising depositing a clear layer in the cavity on top of the phosphor layer.

21 . The method according to claim 19 further comprising depositing metal layer on walls of the cavity to increase light reflection therefrom.

22 . The method according to claim 19 wherein forming a cavity includes forming walls of the cavity to be tapered.

23 . The method according to claim 19 wherein mounting the at least one LED chip includes mounting two LED chips within the cavity.