IP Library Granted Patent US 8,014,890
Granted Patent B2
US 8,014,890 · App. 10/573,698 · Granted Sep 6, 2011

Method for manufacturing a high-frequency assembly

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Quick Facts
Patent No.
US 8,014,890
App. No.
10/573,698
Granted
Sep 6, 2011
Kind
B2
Abstract

In the manufacture of a high-frequency assembly, a plurality of components, at least one ( 12 ) of which is frequency-specific, are placed with respect to each other using a placing apparatus and are interconnected. In a specimen of the frequency-specific component ( 12, 30 ) a feature ( 23, 24 ) which encodes the frequency is looked for. The specimen is built in if the feature ( 23, 24; 26 ) is found in the specimen and is judged to be correct; otherwise the specimen is rejected.

Claims (39)

1. A method of manufacturing a high-frequency assembly including a plurality of components, at least one of which is frequency-specific, using an automatic assembly apparatus, the method comprising:

placing a plurality of components on a high-frequency assembly using a placing apparatus of an automatic assembly apparatus;

identifying a frequency-encoding feature on a frequency-specific component prior to gripping the frequency-specific component with the placing apparatus, the frequency-encoding feature indicating an operating frequency of the frequency-specific component;

accepting the frequency-specific component for connection to the high-frequency assembly if the frequency-encoding feature indicates that the frequency-specific component is a correct component for the assembly; and

rejecting the frequency-specific component for connection to the high-frequency assembly if the frequency-encoding feature indicates that the frequency-specific component is not the correct component for the assembly.

2. The method of claim 1 wherein the frequency-specific component is taken from a stock that comprises a plurality of frequency-specific components, the method further comprising:

rejecting the entire stock of frequency-specific components if a predetermined number of frequency-specific components in the stock are successively rejected for connection.

3. The method of claim 1 further comprising:

searching for the frequency-encoding feature at a plurality of locations on the frequency-specific component; and

determining an orientation of the frequency-specific component based on a location at which the frequency-encoding feature is found.

4. The method of claim 3 further comprising:

identifying a reference point and a reference direction on the frequency-specific component;

forming a number of vectors beginning at the reference point, the vectors being of substantially equivalent length and forming pre-defined angles with respect to the reference direction; and

searching for the frequency-encoding feature at the ends of the vectors.

5. The method of claim 4 wherein each vector includes an end that terminates at a corner of a square.

6. The method of claim 4 further comprising:

determining a rotational position of the frequency-encoding feature; and

distinguishing which of a plurality of features is indicated by the frequency-encoding feature based on the rotational position of the frequency-specific component.

7. The method of claim 1 further comprising:

detecting an outline of the frequency-specific component;

locating the frequency-encoded feature based on the detected outline of the frequency-specific component; and

determining an orientation of the frequency-specific component based on the located frequency-encoded feature.

8. The method of claim 1 wherein the frequency-specific component comprises a circuit board.

9. The method of claim 8 wherein the frequency-encoded feature comprises a conductive material.

10. The method of claim 1 wherein the frequency-specific component comprises a mechanical component.

11. The method of claim 10 wherein the mechanical component comprises a cover that covers a mounted component.

12. The method of claim 1 wherein the frequency-encoded feature comprises a bore.

13. The method of claim 1 wherein the frequency-encoded feature comprises an indication printed on the frequency-specific component.

14. The method of claim 1 , wherein the step of identifying the frequency-encoding feature comprises optically identifying said frequency-encoding feature.

15. A manufacturing apparatus for the automatic manufacture of a high-frequency assembly comprising:

a placing apparatus to place one or more components on a high-frequency assembly, wherein at least one of the components comprises a frequency-specific component;

a sensor to detect a frequency-encoded feature associated with the frequency-specific component that indicates an operating frequency of the frequency-specific component;

a controller operatively connected to the sensor and configured to:

receive a signal from the sensor responsive to the detection of the frequency-encoded feature; and

control the placing apparatus to place the frequency-specific component on the assembly, or to reject the frequency-specific component based on the received signal prior to the component being taken up by the placing apparatus.

16. The apparatus of claim 15 wherein the orientation of the frequency-specific component can be determined from a location at which the feature is found on the frequency-specific component in relation to a reference edge of the component.

17. The apparatus of claim 15 wherein the orientation of the frequency-specific component can be determined from a location at which the frequency-encoded feature is found with respect to the outline of the frequency-specific component.

18. The apparatus of claim 15 wherein the frequency-encoded feature is an optically detectable feature.

19. The apparatus of claim 15 , wherein the sensor is a camera.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 30, 2007
From: MARCONI COMMUNICATIONS GMBH (NOW KNOWN AS TELENT GMBH)
To: ERICSSON AB
Reel/Frame 020218/0769 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 20, 2006
From: KONRATH, WILLIBALD; SCHMELCHER, HAIKO
To: MARCONI COMMUNICATIONS GMBH
Reel/Frame 017813/0357 →