Hot-Melt Adhesive
An adhesive sheet composed of a thermoplastic and optionally one or more resins, wherein a) the adhesive system has a softening temperature of greater than 65° C. and less than 125° C., b) a melt flow index (ISO 1133) of greater than 3 and less than 100 cm 3 /10 minutes, c) a storage modulus G′ at 23° C., as measured by test method A, of greater than 10 7 Pas, d) a loss modulus G″ at 23° C., as measured by test method A, of greater than 10 6 Pas, e) and a crossover, as measured by test method A, of less than 125° C.
1 . An adhesive sheet of an adhesive system composed of a thermoplastic and optionally one or more resins, having
a) a softening temperature of greater than 65° C. and less than 125° C.,
b) a melt flow index (ISO 1133) of greater than 3 and less than 100 cm 3 /10 minutes,
c) a storage modulus G′ at 23° C., as measured by test method A, of greater than 10 7 Pas,
d) a loss modulus G″ at 23° C., as measured by test method A, of greater than 10 6 Pas,
e) and a crossover, as measured by test method A, of less than 125° C.
2 . The adhesive sheet of claim 1 , wherein the layer thickness is between 10 and 100 μm.
3 . The adhesive sheet of claim 1 , wherein said thermoplastic is selected from the group consisting of copolyamides, polyethyl-vinyl acetates, polyvinyl acetates, polyolefins, polyurethanes, and copolyesters.
4 . The adhesive sheet of claim 1 , wherein said resins are reactive resins comprising one or more members of the group consisting of epoxy resins, phenolic resins and novolak resins.
5 . A method for bonding chip modules in card bodies which comprises bonding said chip modules in said card bodies with the adhesive sheet of claim 1 .
6 . The method of claim 5 , wherein said chip modules are polyimide-, polyester or epoxy-based chip modules and said card bodies are PVC, ABS, PET, PC, PP or PE card bodies.
7 . A method for producing a heat-activable adhesive tape, which comprises coating an adhesive system composed of a thermoplastic and optionally one or more resins, having
a) a softening temperature of greater than 65° C. and less than 125° C.
b) a melt flow index (ISO 1133) of greater than 3 and less than 100 cm 3 /10 minutes,
f) a storage modulus G′ at 23° C., as measured by test method A, of greater than 10 7 Pas,
g) a loss modulus G″ at 23° C., as measured by test method A, of greater than 10 6 Pas,
h) and a crossover, as measured by test method A, of less than 125° C. onto a release paper or a release film.
8 . The adhesive sheet of claim 2 , wherein said layer thickness is between 30 and 80 μm.