IP Library Granted Patent US 7,781,522
Granted Patent B2
US 7,781,522 · App. 10/578,798 · Granted Aug 24, 2010

Curable silicone composition and cured product thereof

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Quick Facts
Patent No.
US 7,781,522
App. No.
10/578,798
Granted
Aug 24, 2010
Kind
B2
Abstract

A curable silicone composition includes: (A) an organopolysiloxane represented by the siloxane unit formula (1) given below and having at least two univalent organic groups that contain epoxy groups and are free of aromatic rings: [R 1 3 SiO 1/2 ] a [R 2 2 SiO 2/2 ] b [R 3 SiO 3/2 ] c (where R 1 , R 2 , and R 3 are univalent organic groups, at least two of which are univalent organic groups which contain epoxy groups and are free of aromatic rings; more than 20 mole % of R 3 are aryl groups; a+b+c equals 1; on average, “a” satisfies the following condition: 0≦a≦0.8; on average, “b” satisfies the following condition: 0.2≦b≦0.8; and, on average, “c” satisfies the following condition: 0.2<c<1.0); (B) a linear-chain organopolysiloxane having at least two univalent organic groups that contain phenolic hydroxyl groups; and (C) a curing accelerator.

Claims (21)

1. A curable silicone composition comprising:

(A) an organopolysiloxane represented by the siloxane unit formula (1) given below and having at least two univalent organic groups that contain epoxy groups and are free of aromatic rings:

[R 1 3 SiO 1/2 ] a [R 2 2 SiO 2/2 ] b [R 3 SiO 3/2 ] c   (1)

where R 1 , R 2 , and R 3 are univalent organic groups, at least two of which are univalent organic groups which contain epoxy groups and are free of aromatic rings;

more than 20 mole % of R 3 are aryl groups; a+b+c=1; on average, “a” satisfies the following condition: 0≦a≦0.8; on average, “b” satisfies the following condition: 0≦0.8; and, on average, “c” satisfies the following condition: 0.2≦c≦1.0;

(B) an organopolysiloxane represented by the following formula (4):

Z—(CH 3 ) 2 SiO(CH 3 ) 2 Si—Z  (4)

where Z is 3-(m-hydroxyphenyl)propyl group; and

(C) a curing accelerator.

2. The curable silicone composition of claim 1 , further comprising a filler (D).

3. The curable silicone composition of claim 2 , where component (A) is liquid.

4. The curable silicone composition of claim 2 , where in the siloxane unit formula (1), 0<a≦0.8; and b=0.

5. The curable silicone composition of claim 2 , where component (B) is used in an amount of 1 to 1000 parts by weight, and component (C) in an amount of 0.01 to 100 parts by weight for each 100 parts by weight of component (A).

6. The curable silicone composition of claim 2 , where the epoxy group of component (A) is a glycidoxy group or a 2,4-epoxycyclohexyl group.

7. The curable silicone composition of claim 2 , which is in a liquid or a paste-like form.

8. The curable silicone composition of claim 1 , where component (A) is liquid.

9. The curable silicone composition of claim 1 , where in the siloxane unit formula (1), 0<a≦0.8; and b=0.

10. The curable silicone composition of claim 1 , where component (B) is used in an amount of 1 to 1000 parts by weight, and component (C) in an amount of 0.01 to 100 parts by weight for each 100 parts by weight of component (A).

11. The curable silicone composition of claim 1 , where the epoxy group of component (A) is a glycidoxy group or a 2,4-epoxycyclohexyl group.

12. The curable silicone composition of claim 1 , which is in a liquid or a paste-like form.

13. A cured product obtained by curing the curable silicone composition according to claim 1 .

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 17, 2019
From: DOW CORNING TORAY CO., LTD.
To: DOW TORAY CO., LTD.
Reel/Frame 051322/0925 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 12, 2007
From: MORITA, YOSHITSUGU; ISSHIKI, MINORU; UEKI, HIROSHI; TOGASHI, ATSUSHI
To: DOW CORNING TORAY COMPANY, LTD.
Reel/Frame 018753/0742 →