Lighting device of discharge lamp, illumination apparatus and illumination system
View Patent ↗A lighting device for a lamp device is provided. The lighting device includes a circuit board and film capacitors packaged on the circuit board by using leadless flow solders. Each film capacitor comprises polypropylene films and lead wires, and a material of the lead wires has a thermal conductivity lower than a thermal conductivity of copper, and terminals and internal materials of the film capacitors are leadless. A diameter of the lead wires is 0.6− (mm) or less, a cross-sectional area is 35 mm 2 or less, and a temperature at a terminal end of the lead wires in the film capacitors during a soldering process is 130° C. or less.
1. A lighting device for a lamp device, comprising:
a circuit board; and
film capacitors, packaged on the circuit board by using leadless flow solders,
wherein each film capacitor comprises polypropylene films and lead wires, and a material of the lead wires has a thermal conductivity lower than a thermal conductivity of copper, and terminals and internal materials of the film capacitors are leadless;
wherein the film capacitors are constructed by a combination of a polypropylene film and an aluminum foil, or an aluminum-deposited polypropylene film.
2. The lighting device of claim 1 , wherein a diameter of the lead wires is 0.6φ (mm) or less.
3. The lighting device of claim 1 , wherein a cross-sectional area of the film capacitors is 35 mm 2 or less, and a temperature at a terminal end of the lead wires in the film capacitors during a soldering process is 130° C. or less.
4. The lighting device of claim 1 , wherein a length of the lead wires from the circuit board to the film capacitor is 2 mm or more after the film capacitors are packaged onto the circuit board.
5. The lighting device of claim 1 , wherein circuit elements set on the circuit board are all leadless.
6. An illumination apparatus, comprising:
a lamp; and
a lighting device for lighting the lamp,
wherein the lighting device comprises a circuit board; and film capacitors packaged on the circuit board by using leadless flow solders, wherein each film capacitor comprises polypropylene films and lead wires, and a material of the lead wires has a thermal conductivity lower than a thermal conductivity of copper, and terminals and internal materials of the film capacitors are leadless;
wherein the film capacitors are constructed by a combination of a polypropylene film and an aluminum foil, or an aluminum-deposited polypropylene film.
7. The illumination apparatus of claim 6 , wherein a diameter of the lead wires is 0.6φ (mm) or less.
8. The illumination apparatus of claim 6 , wherein a cross-sectional area is 35 mm 2 or less, and a temperature at a terminal end of the lead wires in the film capacitors during a soldering process is 130° C. or less.
9. The illumination apparatus of claim 6 , wherein a length of the lead wires from the circuit board to the film capacitor is 2 mm or more after the film capacitors are packaged onto the circuit board.
10. The illumination apparatus of claim 6 , wherein circuit elements set on the circuit board are all leadless.
11. An illumination system, comprising:
lamps; and
at least one lighting device for lighting the lamps;
wherein the lighting device comprises a circuit board; and film capacitors packaged on the circuit board by using leadless flow solders, wherein each film capacitor comprises polypropylene films and lead wires, and a material of the lead wires has a thermal conductivity lower than a thermal conductivity of copper, and terminals and internal materials of the film capacitors are leadless;
wherein the film capacitors are constructed with a combination of a polypropylene film and an aluminum foil, or an aluminum-deposited polypropylene film.
12. The illumination system of claim 11 , wherein a diameter of the lead wires is 0.6φ (mm) or less.
13. The illumination system of claim 11 , wherein a cross-sectional area is 35 mm 2 or less, and a temperature at a terminal end of the lead wires in the film capacitors during a soldering process is 130° C. or less.
14. The illumination system of claim 11 , wherein a length of the lead wires from the circuit board to the film capacitor is 2 mm or more after the film capacitors are packaged onto the circuit board.
15. The illumination apparatus of claim 11 , wherein circuit elements set on the circuit board are all leadless.