Curing silicone composition and cured product thereof
View Patent ↗A curable silicone composition comprising: (A) an organopolysiloxane that has a branched molecular structure and contains in one molecule at least two univalent hydrocarbon groups with phenolic hydroxyl groups therein; (B) a linear-chain organopolysiloxane having at least two univalent hydroxyl groups with epoxy groups that are free of aromatic rings; and (C) a curing accelerator.
1. A curable silicone composition comprising:
(A) an organopolysiloxane that has a branched molecular structure and contains in one molecule at least two univalent hydrocarbon groups with phenolic hydroxyl groups therein;
(B) a linear-chain organopolysiloxane having at least two univalent hydrocarbon groups with epoxy groups that are free of aromatic rings; and
(C) a curing accelerator.
2. The curable silicone composition of claim 1 , further comprising a filler (D).
3. The curable silicone composition according to claim 1 , wherein said component (A) is represented by the following silicone unit formula (1):
[R 1 3 SiO 1/2 ] a [R 2 2 SiO 2/2 ] b [R 3 SiO 3/2 ] c (1)
(where R 1 , R 2 , and R 3 are C 1-20 organic groups, at least two of which are univalent hydrocarbon groups with phenolic hydroxyl groups; <<a+b+c=1>>; <<a>>, on average, satisfies the following condition: <<0≦a≦0.8>>, <<b>>, on average, satisfies the following condition: <<0≦b≦0.8>>, and, <<c>>, on average, satisfies the following condition: <<0.2≦c≦1.0>>).
4. The curable silicone composition according to claim 1 , wherein said component (A) is represented by the following silicone unit formula (2):
[R 4 3 SiO 1/2 ] d [R 5 2 SiO 2/2 ] e [SiO 4/2 ] f (2)
(where R 4 , R 5 are C 1-20 organic groups, at least two of which are univalent hydrocarbon groups with phenolic hydroxyl groups; <<d+e+f=1>>; <<d/f>>, on average, satisfies the following condition: <<0.02≦d/f≦4>>, <<d>>, on average, satisfies the following condition: <<0<d≦0.8>>, <<e>>, on average, satisfies the following condition: <<0≦e≦0.98>>, and <<f>>, on average, satisfies the following condition: <<0.002≦f≦0.98>>).
5. The curable silicone composition according to claim 1 , wherein said component (A) is a liquid.
6. The curable silicone composition of claim 3 , wherein in said formula (1) that represents component (A), <<a>> satisfies the following condition: <<0<a≦0.8>> and <<b>> is equal to 0.
7. The curable silicone composition according to claim 1 , wherein said component (B) is an organopolysiloxane represented by the following structural formula (3):
R 7 3 SiO(R 8 2 SiO) m SiR 7 3 (3)
(wherein R 7 and R 8 are the same or different C 1-20 organic groups, at least two of which are univalent hydrocarbon groups with epoxy groups that are free of aromatic rings, and <<m>> is an integer between 0 and 1000).
8. The curable silicone composition according to claim 1 , wherein component (B) is used in an amount of 1 to 1000 parts by weight, and component (C) is used in an amount of 0.01 to 100 parts by weight per 100 parts by weight of component (A).
9. The curable silicone composition according to claim 1 , wherein said univalent hydrocarbon group with epoxy group of said component (B) is an alkyl group bonded to a glycidoxy group or an alkyl group bonded to 3,4-epoxycyclohexyl group.
10. The curable silicone composition according to claim 1 , which is a liquid or a paste.
11. A cured product obtained by curing a curable silicone composition as claimed in claim 1 .
12. The curable silicone composition according to claim 2 , wherein said component (A) is represented by the following silicone unit formula (1):
[R 1 3 SiO 1/2 ] a [R 2 2 SiO 2/2 ] b [R 3 SiO 3/2 ] c (1)
(where R 1 , R 2 , and R 3 are C 1-20 organic groups, at least two of which are univalent hydrocarbon groups with phenolic hydroxyl groups; <<a+b+c=1>>; <<a>>, on average, satisfies the following condition: <<0≦a≦0.8>>, <<b>>, on average, satisfies the following condition: <<0≦b≦0.8>>, and, <<c>>, on average, satisfies the following condition: <<0.2≦c≦1.0>>).
13. The curable silicone composition according to claim 2 , wherein said component (A) is represented by the following silicone unit formula (2):
[R 4 3 SiO 1/2 ] d [R 5 2 SiO 2/2 ] e [SiO 4/2 ] f (2)
(where R 4 , R 5 are C 1-20 organic groups, at least two of which are univalent hydrocarbon groups with phenolic hydroxyl groups; <<d+e+f=1>>; <<d/f>>, on average, satisfies the following condition: <<0.02≦d/f≦4>>, <<d>>, on average, satisfies the following condition: <<0<d≦0.8>>, <<e>>, on average, satisfies the following condition: <<0≦e≦0.98>>, and <<f>>, on average, satisfies the following condition: <<0.002≦f≦0.98>>).
14. The curable silicon composition according to claim 2 , wherein said component (A) is a liquid.
15. The curable silicone composition of claim 12 , wherein in said formula (1) that represents component (A), <<a>> satisfies the following condition: <<0<a≦0.8>> and <<b>> is equal to 0.
16. The curable silicone composition according to claim 2 , wherein said component (B) is an organopolysiloxane represented by the following structural formula (3):
R 7 3 SiO(R 8 2 SiO) m SiR 7 3 (3)
(wherein R 7 and R 8 are the same or different C 1-20 organic groups, at least two of which are univalent hydrocarbon groups with epoxy groups that are free of aromatic rings, and <<m>> is an integer between 0 and 1000).
17. The curable silicone composition according to claim 2 , wherein component (B) is used in an amount of 1 to 1000 parts by weight, and component (C) is used in an amount of 0.01 to 100 parts by weight per 100 parts by weight of component (A).
18. The curable silicone composition according to claim 2 , wherein said univalent hydrocarbon group with epoxy group of said component (B) is an alkyl group bonded to a glycidoxy group or an alkyl group bonded to 3,4-epoxycyclohexyl group.
19. The curable silicone composition according to claim 2 , which is a liquid or a paste.