IP Library Granted Patent US 8,129,479
Granted Patent B2
US 8,129,479 · App. 10/586,858 · Granted Mar 6, 2012

Pressure sensitive adhesive composition

Assignee: Kaneka Corporation
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 8,129,479
App. No.
10/586,858
Granted
Mar 6, 2012
Kind
B2
Abstract

The present invention has its object to provide a pressure sensitive adhesive composition which can be applied using no organic solvent and which manifests excellent pressure sensitive adhesion characteristics. This object can be achieved by a pressure sensitive adhesive composition which comprises, as essential constituents, the following: (A) a hydrolyzable silyl group-containing organic polymer containing at least 1.3 hydrolyzable silyl groups per molecule and having a number average molecular weight of 15,000 to 100,000; (B) a hydrolyzable silyl group-containing organic polymer containing 0.3 to 1.3 hydrolyzable silyl groups per molecule and having a number average molecular weight of 500 to 15,000; and (C) a tackifier resin.

Claims (24)

1. A pressure sensitive adhesive product

comprising a support

obtained by applying a pressure sensitive adhesive composition

which comprises the following components (A), (B) and (C) to the support and thermally curing the pressure sensitive adhesive composition:

(A) a hydrolyzable silyl group-containing organic polymer containing at least 1.3 hydrolyzable silyl groups per molecule and having a number average molecular weight of 20,000 to 50,000, the main chain of the organic polymer being substantially composed of a repeating unit or units represented by the general formula —R 1 —O— (R 1 being a divalent alkylene group);

(B) a hydrolyzable silyl group-containing organic polymer containing 0.3 to 1.3 hydrolyzable silyl groups per molecule and having a number average molecular weight of 3,000 to 10,000, a compounding ratio of which is 3 to 100 parts by weight relative to 100 parts by weight of (A), and the main chain of which polymer being substantially composed of a repeating unit or units represented by the general formula —R′-O— (R′ being a divalent alkylene group);

(C) a tackifier resin selected from the group consisting of terpene resins, terpene phenol resins, petroleum resins, rosin ester resins, and admixtures thereof, and

a compounding ratio of which is 30 to 100 parts by weight, relative to a combined total of 100 parts by weight of (A) and (B).

2. The pressure sensitive adhesive product according to claim 1

wherein the main chain of the hydrolyzable silyl group-containing organic polymers (A) and (B) is substantially polyoxypropylene.

3. The pressure sensitive adhesive product according to claim 2

wherein the hydrolyzable silyl group of the hydrolyzable silyl group-containing organic polymers (A) and (B) is represented by the following general formula (I):

—SiX a R 2 3-a   (I)

(wherein, R 2 represents a substituted or unsubstituted monovalent organic group containing 1 to 20 carbon atoms, X represents a hydrolyzable group, and a represents 1, 2 or 3).

4. The pressure sensitive adhesive product according to claim 1

wherein the hydrolyzable silyl group of the hydrolyzable silyl group-containing organic polymers (A) and (B) is represented by the following general formula (I):

—SiX a R 2 3-a   (I)

(wherein, R 2 represents a substituted or unsubstituted monovalent organic group containing 1 to 20 carbon atoms, X represents a hydrolyzable group, and a represents 1, 2 or 3).

5. The pressure sensitive adhesive product according to claim 1 , wherein the support is at least one selected from the group consisting of synthetic resin films, modified natural films, paper, cloth and metal foils.

6. The pressure sensitive adhesive product according to claim 1 , wherein the pressure sensitive adhesive composition is cured at a temperature of 50° to 180° for 1 minute to 1 hour.

7. The pressure sensitive adhesive product according to claim 1 , which is selected from the group consisting of pressure sensitive adhesive tapes, pressure sensitive adhesive sheets, pressure sensitive adhesive films and pressure sensitive adhesive labels.

8. The pressure sensitive adhesive product according to claim 1 , wherein the pressure sensitive adhesive composition does not contain a filler.

9. The pressure sensitive adhesive product according to claim 1 , further comprising a release liner.

10. The pressure sensitive adhesive product according to claim 1 , wherein the compounding ratio of (B) is 30 to 100 parts by weight relative to 100 parts by weight of (A).

Assignments (2)
CHANGE OF ADDRESS Recorded Jan 15, 2014
From: KANEKA CORPORATION
To: KANEKA CORPORATION
Reel/Frame 032019/0901 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 27, 2006
From: UEDA, KAZUHIKO; IWAKIRI, HIROSHI
To: KANEKA CORPORATION
Reel/Frame 018494/0425 →
Priority Claims (1)
JP 2004-024173 · Jan 30, 2004 · national
Continuity (1)
Related Publication 20070123662A1 · May 31, 2007