Metal deposition
View Patent ↗A method for electroless plating of metal on a laser-patterned substrate. A substrate is provided on which both a thermal imaging layer and catalytic layer are deposited. On exposure to a laser beam, sufficient levels of radiation are converted to heat in the thermal imaging layer to render the exposed regions of the adjacent catalytic layer inactive. The laser-patterned substrate is then exposed to a reaction solution which initiates the growth of a metal film on the unexposed regions of the catalytic layer.
1. A method of forming a metal deposit on a substrate, the method including:
providing a substrate with a first layer of a catalyst material for the deposition of metal from a solution of metal ions, which catalyst material is deactivatable by heating;
using an irradiative technique to selectively heat selected regions of the first layer to pattern the first layer into active and non-active regions; and
exposing the resulting pattern of active and non-active regions to a solution of metal ions whereby metal is selectively deposited therefrom onto the active regions of the first layer.
2. A method according to claim 1 , wherein the said irradiative technique forms active regions of the said first layer isolated by non-active regions from other surrounding catalytically active regions.
3. A method according to claim 1 , wherein a thermal imaging layer is provided below said first layer to assist the selective heating of said selected regions of the first layer.
4. A method according to claim 1 , wherein a thermal imaging layer is provided over said first layer to assist the selective heating of said selected regions of the first layer; and including the further step of removing the thermal imaging layer after the step of patterning the first layer into non-active and active regions.
5. A method according to claim 1 , wherein the radiation is of infrared wavelength.
6. A method according to claim 1 , including the step of selectively depositing the first layer onto selected locations of the substrate corresponding coarsely to those locations where metal is to be deposited.
7. A method of forming a metal deposit on a substrate, the method including:
depositing on selected locations of a substrate coarse zones of a first layer of a material whose activity as a catalyst for the deposition of metal from a solution of metal ions is adjustable by an irradiative technique;
using said irradiative technique to pattern each coarse zone into active and non-active regions; and
exposing the resulting pattern of active and non-active regions to a solution of metal ions whereby metal is selectively deposited therefrom onto the active regions of the coarse zones of the first layer.
8. A method according to claim 7 , wherein said first layer zones are deposited by ink-jet printing.
9. A method according to claim 1 of forming at least one metal element of an electronic device.
10. A method according to claim 9 , wherein said electronic device forms a component of an electrical or electronic device.
11. A method of producing an electrical or electronic circuit, including the step of forming at least one metal element thereof by a method according to claim 1 .
12. A method according to claim 11 , wherein the electrical or electronic circuit is a logic circuit.
13. A method according to claim 11 , wherein the electrical or electronic circuit is a display or memory device including active matrix circuitry.
14. A method according to claim 11 , wherein the electrical or electronic device comprises an array of interconnections.
15. A method according to claim 1 , wherein the first layer comprises a composition including a catalyst for the reduction of metal ions, and a chromophore.
16. A method according to claim 15 , wherein the chromophore is a chemical moiety that absorbs infrared radiation.
17. A method according to claim 15 , wherein the chromophore is carbon black.
18. A method according to claim 1 , wherein the deposition of metal from the solution of metal ions is an electroless plating technique.
19. A method of forming a metal deposit on a substrate, the method including:
providing a substrate with a first layer of a catalyst material for the deposition of metal from a solution of metal ions, which catalyst material is deactivatable by heating;
using an irradiative technique to selectively heat selected regions of the first layer to pattern the first layer into active and non-active regions; and
using the resulting pattern of active and non-active regions to control the deposition of metal onto the substrate from a solution of metal ions.