IP Library Granted Patent US 7,891,864
Granted Patent B2
US 7,891,864 · App. 10/589,912 · Granted Feb 22, 2011

Method, device and system for controlling heating circuits

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Quick Facts
Patent No.
US 7,891,864
App. No.
10/589,912
Granted
Feb 22, 2011
Kind
B2
Abstract

A heat control apparatus for a circuit includes: a heat detecting unit which acquires the heat generation condition of a semiconductor integrated circuit from an inspection image obtained by capturing an image of the semiconductor integrated circuit by an image capturing sensor; and a cooling control unit which controls a cooling means for cooling the semiconductor integrated circuit in accordance with the acquired heat generation condition.

Claims (14)

1. A heat control apparatus for a circuit, comprising:

a transparent cooling mechanism tightly secured to a semiconductor integrated circuit, the transparent cooling mechanism having a hollow part;

an image capturing sensor which captures an image of the semiconductor integrated circuit through the cooling mechanism;

a heat detecting unit which acquires the heat generation condition of the semiconductor integrated circuit from an inspection image captured by the sensor;

an analyzing unit which analyzes the acquired heat generation condition; and

a driving mechanism for causing a coolant to flow in the hollow part of the transparent cooling mechanism, wherein the hollow part is provided so as not to overlap at least a portion of the semiconductor integrated circuit subject to observation by the image capturing sensor.

2. The heat control apparatus for a circuit according to claim 1 , wherein the cooling mechanism is a silicon heat spreader and comprises a cooling means for cooling the heat spreader.

3. The heat control apparatus for a circuit according to claim 1 , wherein the driving mechanism changes the direction of flow of the coolant as appropriate.

4. The heat control apparatus for a circuit according to claim 3 , wherein the analyzing unit synthetically analyzes heat generation conditions detected prior to and subsequent to a change in the direction of flow of the coolant.

5. The heat control apparatus for a circuit according to claim 1 , wherein the analyzing unit analyzes the heat generation condition by taking into account temperature gradient dependent on the direction of flow of the coolant.

6. The heat control apparatus for a circuit according to claim 1 , wherein the heat detecting unit acquires the temperature distribution of the semiconductor integrated circuit from the inspection image, and if the temperature exceeds a predetermined threshold value at any location in the semiconductor integrated circuit, the cooling control unit enhances the cooling capability of the cooling means.

7. The heat control apparatus for a circuit according to claim 1 , further comprising:

an operation control unit for controlling the operating condition of the semiconductor integrated circuit in accordance with the acquired heat generation condition.

8. The heat control apparatus for a circuit according to claim 7 , wherein the heat detecting unit acquires the temperature distribution of the semiconductor integrated circuit from the inspection image, and if the temperature exceeds a predetermined threshold value at any location in the semiconductor integrated circuit, the operation control unit reduces a load per unit time in the location where the temperature exceeds the threshold value.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 27, 2011
From: SONY NETWORK ENTERTAINMENT PLATFORM INC.
To: SONY COMPUTER ENTERTAINMENT INC.
Reel/Frame 027449/0380 →
CHANGE OF NAME Recorded Dec 26, 2011
From: SONY COMPUTER ENTERTAINMENT INC.
To: SONY NETWORK ENTERTAINMENT PLATFORM INC.
Reel/Frame 027445/0773 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 13, 2006
From: YAZAWA, KAZUAKI; TAMURA, TETSUJI
To: SONY COMPUTER ENTERTAINMENT INC.
Reel/Frame 018509/0275 →