Polyimidesiloxane solution composition
View Patent ↗[PROBLEMS] To provide a polyimidesiloxane solution composition that is excellent in defoaming ability and that can maintain the wettability of an outer lead bonded portion on a wiring board at a high level, even when it is applied on the surface of the wiring board and then cured, to form an insulating cured film. [MEANS FOR SOLVING PROBLEMS] A polyimidesiloxane solution composition which comprises an organic solvent, polyimidesiloxane soluble in the organic solvent, a curable components such as an epoxy compound and a polyvalent isocyanate compound, and a silicone defoamer, wherein the silicone defoaming agent comprises dimethylpolysiloxane, a polysiloxane compound having a hydrophilic group in a side chain or a terminal moiety, and a micro-powder silica.
1. A polyimidesiloxane solution composition comprising an organic solvent, a polyimidesiloxane soluble in the organic solvent, at least one curing component selected from the group consisting of an epoxy compound and a polyvalent isocyanate compound, and a silicone defoamer, wherein the silicone defoamer comprises dimethylpolysiloxane, a polysiloxane compound having a hydrophilic group in a side chain thereof or at a terminal thereof, and a micro-powdery silica.
2. The polyimidesiloxane solution composition of claim 1 , which comprises 1 to 50 weight parts of the curing component and 1 to 10 weight parts of the silicone defoamer per 100 weight parts of the polyimidesiloxane soluble in the organic solvent.
3. The polyimidesiloxane solution composition of claim 1 , in which the defoamer contains the polysiloxane compound having a hydrophilic group in a side chain thereof or at a terminal thereof in an amount larger than an amount of the dimethylpolysiloxane.
4. The polyimidesiloxane solution composition of claim 1 , in which the defoamer comprises 1 to 20 weight parts of the micro-powdery silica per total 100 weight parts of the dimethylpolysiloxane and the polysiloxane compound having a hydrophilic group in a side chain thereof or at a terminal thereof.
5. The polyimidesiloxane solution composition of claim 1 , in which the hydrophilic group in the side chain or at the terminal of the polysiloxane compound is a polyoxyalkylene group.
6. The polyimidesiloxane solution composition of claim 5 , in which the polyoxyalkylene group is a group comprising a copolymer of ethylene oxide and propylene oxide.
7. The polyimidesiloxane solution composition of claim 1 , which further comprises an inorganic filler.
8. The polyimidesiloxane solution composition of claim 1 , which further comprises a curing catalyst.
9. The polyimidesiloxane solution composition of claim 1 , in which the silicone defoamer shows a water drop contact angle of not higher than 50°.
10. A method of preparing a wiring board having an insulating cured film on a surface thereof, which comprises a step of coating the polyimidesiloxane solution composition of claim 1 on a local area of an electric circuit surface of a wiring board to form a coated film, and a step of heating the coated film to give an insulating cured film.
11. A method of connecting an electronic component to a wiring board, which comprises the steps of coating the polyimidesiloxane solution composition of claim 1 on a local area of an electric circuit surface of a wiring board to form a coated film, heating the coated film to give an insulating cured film, and connecting an electronic component via an anisotropic conductive material to a wiring surface of the wiring board in an area having no insulating cured film thereon.