Component with Encapsulation Suitable for Wlp and Production Method

1 . An electrical component comprising:

a substrate comprising one or more terminal contacts for one or more electrical component structures on a surface of the substrate,

a cover having a first surface and a second surface, the cover comprising:

one or more terminal pads on the first surface;

one or more outside contacts on the second surface; and

electrical throughplatings electrically connecting the terminal pads on the first surface and the outside contacts on the second surface; wherein the cover is on the surface of the substrate; and

a conductive adhesive in one or more cavities between the substrate and the cover, the conductive adhesive forming an electrical connection between the terminal contacts on the substrate and the terminal pads.

2 . The electrical component of claim 1 , wherein the cavities extend from an outer edge of the component.

3 . The electrical component of claim 1 , further comprising an interface layer between the substrate and the cover, wherein the cavities are in the interface layer.

4 . The component of claim 1 , further comprising an enclosed frame structure between the substrate and the cover in an area of an outer edge of the electrical component, the enclosed frame structure comprising one or more recesses that form the cavities.

5 . The component as of claim 4 , wherein:

the enclosed frame structure encloses the electrical component structures,

the terminal contacts on the substrate are outside the frame structure, and

the substrate is in direct contact with a first side of the enclosed frame structure and the cover is in direct contact with a second side of the enclosed frame structure.

6 . The component of claim 1 , wherein the cover includes a plurality of dielectric layers and a plurality of metallizations on a dielectric layer or among the dielectric layers respectively.

7 . The component of claim 1 , wherein the conductive adhesive comprises a reaction resin configured to harden at low temperatures, the reaction resin including electrically conducting particles.

8 . A process for producing a component, the component including a substrate that includes component regions that comprise component structures and terminal contacts and a cover having a surface, the cover including terminal pads on the surface; the method for producing the component comprising:

arranging the cover such that at least some of the terminal pads are located substantially opposite corresponding ones of the terminal contacts in cavities, wherein the cavities of a plurality of the component regions are connected via channels;

forming an electrical contact between terminal contacts and corresponding terminal pads by injecting a conductive adhesive into the channels until the cavities are substantially filled with the conductive adhesive; and

separating the component regions such that electrical connections between the cavities are interrupted.

9 . The process of claim 8 , further comprising:

arranging frame structures between the substrate and the cover such that a particular frame structure encloses a particular component region and the terminal contacts for the particular component region are located outside the particular frame structure, wherein the channels (CH) are formed between the frame structures of adjacent component regions and the channels are covered by the substrate and the cover.

10 . The process of claim 8 , wherein the conductive adhesive comprises a reaction resin that includes electrically conducting particles.

11 . The process of claim 9 , further comprising:

producing the frame structures by applying a photoresist onto one or both of the the substrate and the cover; and

patterning the photoresist.

12 . The process of claim 9 , further comprising:

producing the frame structures on a surface of the substrate; and

bonding the frame structures to the cover.

13 . The process of claim 9 , further comprising planarizing the frame structures.

14 . The process of claim 8 , wherein injecting the conductive adhesive comprises injecting the conductive adhesive under pressure into the channels.

15 . The process of claim 8 , wherein separating the component regions further comprises:

sawing the component to separate the component regions, wherein sawing comprises:

forming saw cuts in a direction substantially parallel to the channels such that the conductive adhesive remains in the cavities and such that the channels are separated from cavities.

16 . The process of claim 15 , further comprising sealing one or more edges of the frame structure with a coating.

17 . The process of claim 16 , wherein sealing one or more edges of the frame structure comprises sealing one or more edges of the frame structure using a method selected from the group consisting of applying a varnish and using chemical vapor deposition.

18 . The process of claim 8 , wherein:

the cavities are only at one longitudinal edge of the component regions; and

the channels are substantially parallel to the one longitudinal edge and are arranged in a substantially straight line.

19 . The process of claim 15 , wherein sawing to separate the component regions further comprises:

making a first saw cut with a first cutting width to electrically separate cavities filled with the conductive adhesive from one another and to form a channel,

filling the channel with insulating material; and

making a second saw cut with a second cutting width at a distance to the cavities in the first saw cut, the second cutting width being less than the first cutting width.

20 . The process as defined in claim 19 , wherein filling the channel with insulating material comprises filling less than all of the channel with a single layer of the insulating material.

21 . The process of claim 15 wherein the cover comprises a printed circuit board comprised of synthetic material and the method further comprises applying a thermal mechanically adjusted synthetic layer to a back side of the substrate.

22 . The electrical component of claim 1 , wherein the cavities are arranged in a vicinity of an outer edge of the electrical component.

23 . The process of claim 9 , further comprising:

producing the frame structure on a surface of the cover; and

bonding the frame structure to the substrate.

24 . The process of claim 9 , further comprising:

producing a first portion of the frame structure on a surface of the a substrate;

producing a second portion of the frame structure on a surface of the cover; and

bonding the first portion of the frame structure to the second portion of the frame structure.