IP Library Granted Patent US 8,242,202
Granted Patent B2
US 8,242,202 · App. 10/592,490 · Granted Aug 14, 2012

Curable liquid resin composition

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Quick Facts
Patent No.
US 8,242,202
App. No.
10/592,490
Granted
Aug 14, 2012
Kind
B2
Abstract

The invention relates to a curable liquid resin composition comprising the following components (A), (B), and (C): (A) a urethane (meth)acrylate oligomer, (B) a monomer shown by the following formula (1), CH 2 ═CR 1 COOR 2 (1) wherein R 1 represents a hydrogen atom or a methyl group and R 2 represents a monovalent organic group, 40 wt % or more of the total amount of the component (B) being a monomer in which the R 2 group in the formula (1) is a nonpolar organic group, and the monomer in the component (B) in which the R 2 group in the formula (1) is a nonpolar organic group being hereinafter referred to as “nonpolar (meth)acrylate-containing monomer”, and (C) a polymerization initiator.

Claims (17)

1. A curable liquid resin composition comprising the following components (A), (B), (C), (D), and (E):

(A) a urethane (meth)acrylate obtained from a diol compound, an aromatic diisocyanate compound in an amount of 1.1-1.8 molar equivalents for one mol of the diol compound, and a hydroxyl group-containing (meth)acrylate compound;

(B) 2-ethylhexyl acrylate;

(C) a polymerization initiator;

(D) a silane coupling agent; and

(E) a polymerizable unsaturated monomer which is a lactam containing a vinyl group;

wherein the diol compound in component (A) is a polyether diol having an average molecular weight of 1,000-5,000, which is a ring-opening polymer of one or more ion-polymerizable cyclic compounds having 2-4 carbon atoms;

wherein the stress-relaxation time, which is defined as the time required for the stress to decline to 37% of the initial stress when a tensile strain of 5% is applied to the cured resin composition at a humidity of 50%, is 10 minutes or less; and

wherein said hydroxyl group-containing (meth)acrylate compound is in an amount which is 0.1 to 0.7 equivalent for one equivalent of the hydroxyl group of the diol compound.

2. The curable liquid resin composition according to claim 1 , wherein the Young's modulus of the cured product, obtained by curing the composition is 10 MPa or less and the urethane (meth)acrylate (A) has a polystyrene-reduced molecular weight measured by gel permeation chromatography of 1,500-20,000.

3. The curable liquid resin composition according to claim 1 , wherein the Young's modulus of the cured product, obtained by curing the composition is 100-2,500 MPa and the urethane (meth)acrylate (A) has a polystyrene-reduced molecular weight measured by the gel permeation chromatography of 500-20,000.

4. The curable liquid resin composition according to claim 1 , wherein the composition is colored.

5. A cured product obtained by curing the curable liquid resin composition according to claim 1 .

6. A coated optical fiber comprising a glass optical fiber having a primary coating, a coated optical fiber comprising a glass optical fiber having a primary coating and a secondary coating, a coated optical fiber comprising a glass optical fiber having a primary coating, a secondary coating and an upjacketing coating, a coated optical fiber comprising a glass optical fiber and a single coating, a coated optical fiber comprising a glass optical fiber, a single coating and an upjacketing coating, and each coated fiber optionally having an ink composition applied thereon, and to an optical fiber ribbon comprising at least two of said coated and optionally inked optical fibers wherein at least one of said coating or composition is derived from the curable liquid resin composition according to claim 1 .

7. The cured product of claim 5 which is a product selected from the group consisting of a primary coating, a secondary coating, an ink composition, and a matrix material on an optical glass fiber.

8. An optical fiber, comprising a cured product of claim 5 as a primary coating.

9. An optical fiber, comprising a cured product of claim 5 as a secondary coating.

Assignments (5)
CHANGE OF CORPORATE ADDRESS Recorded Mar 30, 2022
From: COVESTRO (NETHERLANDS) B.V.
To: COVESTRO (NETHERLANDS) B.V.
Reel/Frame 059546/0570 →
CHANGE OF NAME Recorded Jul 2, 2021
From: MS HOLDING B.V.
To: COVESTRO (NETHERLANDS) B.V.
Reel/Frame 056756/0513 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 25, 2021
From: DSM IP ASSETS B.V.
To: MS HOLDING B.V.
Reel/Frame 056726/0106 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 7, 2016
From: JSR CORPORATION
To: DSM IP ASSETS B.V.
Reel/Frame 040235/0025 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 20, 2007
From: YAMAGUCHI, HIROSHI; KAMO, SATOSHI; SHIGEMOTO, TAKEO; KOMIYA, ZEN
To: JSR CORPORATION; DSM IP ASSETS B.V.
Reel/Frame 020141/0391 →