IP Library Granted Patent US 8,076,679
Granted Patent B2
US 8,076,679 · App. 10/593,446 · Granted Dec 13, 2011

Nitride-based semiconductor light-emitting diode and illuminating device

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Quick Facts
Patent No.
US 8,076,679
App. No.
10/593,446
Granted
Dec 13, 2011
Kind
B2
Abstract

A plurality of semiconductor layers including a light-emitting layer ( 14 ) are formed on the main surface of a substrate ( 10 ) which is composed of a group III-V nitride semiconductor. A first n-type semiconductor layer ( 12 ) containing indium is formed between the light-emitting layer ( 14 ) and the substrate ( 10 ), thereby reducing the affect of damage in the substrate surface. By having such a structure, there is realized a semiconductor light-emitting device having uniform characteristics.

Claims (25)

1. A light-emitting diode comprising:

a substrate made of group III-V nitride semiconductor;

a first n-type semiconductor layer containing indium and formed over a main surface of the substrate;

a light-emitting layer formed over the first n-type semiconductor layer;

a second n-type semiconductor layer formed between the substrate and the first n-type semiconductor layer;

a third n-type semiconductor layer formed between the first n-type semiconductor layer and the light-emitting layer; and

a fourth n-type semiconductor layer formed between the first n-type semiconductor layer and the light-emitting layer, the fourth n-type semiconductor layer being directly formed on the third n-type semiconductor layer,

wherein the third n-type semiconductor layer is a contact layer on which an n-side electrode is formed.

2. The diode of claim 1 ,

wherein the fourth n-type semiconductor layer is made of a compound whose general formula is represented by Al e Ga 1-e N (0≦e<1).

3. The diode of claim 2 ,

wherein the fourth n-type semiconductor layer is a cladding layer.

4. The diode of claim 3 ,

wherein the cladding layer has a thickness of 5 to 200 nm inclusive.

5. An illuminating device comprising multiple light-emitting diodes,

wherein the diodes including:

a substrate made of group III-V nitride semiconductor;

a first n-type semiconductor layer containing indium and formed over a main surface of the substrate;

a light-emitting layer formed over the first n-type semiconductor layer;

a second n-type semiconductor layer formed between the substrate and the first n-type semiconductor layer;

a third n-type semiconductor layer formed between the first n-type semiconductor layer and the light-emitting layer; and

a fourth n-type semiconductor layer formed between the first n-type semiconductor layer and the light-emitting layer, the fourth n-type semiconductor layer being directly formed on the third n-type semiconductor layer,

wherein the third n-the semiconductor layer is a contact layer on which an n-side electrode is formed.

6. The diode of claim 1 , wherein the first n-type layer is a monolayer.

7. The illuminating device of claim 5 , wherein the first n-type layer is a monolayer.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 27, 2020
From: PANASONIC CORPORATION
To: PANASONIC SEMICONDUCTOR SOLUTIONS CO., LTD.
Reel/Frame 052755/0917 →