Cationically curable epoxy resin composition
View Patent ↗The objective of the present invention is to provides a cationically curable epoxy resin composition excellent in sealing and adhesive property specifically to glass, excellent reflow resistance property, moisture resistance and water resistance while keeping a good workability intrinsic to a light curable resins. The invention provides a cationically curable epoxy resin composition comprising: (a) an epoxy resin component; (b) a cationic photo-initiator; (c) a cationic thermal-initiator and (d) a filler selected from the group consisting of oxides, hydroxides and carbonates containing a Group II element in the long periodic table.
1. A cationically curable epoxy resin composition comprising:
(a) an epoxy resin component comprising the combination of bisphenol A epoxy resin, hydrogenated bisphenol A epoxy resin and dicyclopentadiene epoxy resin;
(b) a cationic photo-initiator;
(c) a cationic thermal-initiator; and
(d) a filler selected from the group consisting of oxides, hydroxides and carbonates, each containing a Group II element in the long periodic table.
2. A composition according to claim 1 , wherein the composition comprises 0.1 to 10 parts by weight of cationic photo-initiator, 0.01 to 5 parts by weight of the cationic thermal-initiator and 1 to 100 parts by weight of the filler each based on the 100 parts by weight of the epoxy resin component.
3. A composition according to claim 1 , wherein the cationic photo-initiator is a salt represented by A + B which produces cationic active species by irradiation of light; the cation A + selected from the group consisting of aromatic iodonium ions and aromatic sulfonium ions.
4. A composition according to claim 3 , wherein the anion B in the cationic photo-initiator is selected from the group consisting of SbF 6 ; PF 6 ; AsF 6 ; BF 4 and B(aryl) 4 .
5. A composition according to claim 1 , wherein the cationic thermal-initiator is a salt represented by A + B which produces cationic active species by heat; the cation A + is selected from the group consisting of sulfonium ions in which at least one among three groups bonding to the S-atom is alkyl group and sulfonium ions in which two among three groups bonding to the S-atom form together an alkylene group to form a ring with S-atom.
6. A composition according to claim 5 , wherein the anion B in the cationic thermal-initiator is selected from the group consisting of SbF 6 ; PF 6 ; AsF 6 ; BF 4 ; and B(aryl) 4 .
7. A composition according to claim 1 , further comprising a polyol compound.
8. A composition according to claim 1 , wherein the Group II element in the filler is selected from the group consisting of magnesium, calcium and barium.
9. A composition according to claim 8 , wherein the Group II element in the filler is magnesium.
10. A composition according to claim 1 , wherein the filler is selected from the group consisting of MgO, Mg(OH) 2 , talc, cordierite, magnesium meta-silicate and magnesium ortho-silicate.
11. A semiconductor device package comprising at least two substrates, at least one of which being constructed from glass, sealed by the product of UV radiation exposure on the composition of claim 1 .