Cathodic protection compounds
View Patent ↗A cathodic protection compound is disclosed. The coating includes sacrificial metallic particles less noble than metal in the metal substrate to be protected. The coating also includes inherently conductive polymer in an amount of less than 1 weight percent of total solids of the coating. A concentrate of the metallic particles and inherently conductive polymer can also be prepared.
1. A cathodic protection compound to protect a metal substrate, comprising:
(a) inherently conductive polymer comprising polyaniline-grafted-lignosulfonic acid;
(b) metal particles wherein the metal is less noble than metal of the metal substrate; and
(c) binder,
wherein the amount of inherently conductive polymer is less than 0.8 weight percent of total solids of the compound and wherein the amount of metal particles is less than 20 percent of the total solids of the compound.
2. The compound of claim 1 , wherein the amount of inherently conductive polymer ranges from an electrically effective amount to less than 0.8 weight percent of total solids of the compound.
3. The compound of claim 1 , wherein the amount of inherently conductive polymer ranges from 0.14 weight percent to 0.5 weight percent of total solids of the compound.
4. The compound of claim 1 , wherein the metal particles have an average particle size ranging from about 1 μm to about 25 μm.
5. The compound of claim 1 , wherein the metal substrate comprises iron and the metal particles are selected from the group consisting of zinc, aluminum, tin, and combinations thereof.
6. The compound of claim 1 , wherein the binder is a flowable material.
7. The compound of claim 6 , wherein the flowable material is electrically inactive.
8. The compound of claim 6 , wherein the flowable material is electrically active.
9. The compound of claim 8 , wherein the flowable material includes electrically active, galvanically inactive materials selected from the group consisting of carbon fibers, carbon particles, carbon nanotubes, and combinations thereof.
10. The compound of claim 1 , wherein the weight ratio of total solids of inherently conductive polymer to metal particles can range from about 20:1 to about 40:1.
11. A method of using a cathodic protection compound for a metal substrate, comprising the steps of:
(a) selecting a cathodic protection compound of claim 1 , wherein the metal particles are less noble than metal of the metal substrate, and
(b) applying the cathodic protection compound to the metal substrate.