IP Library Granted Patent US 6,967,361
Granted Patent B2
US 6,967,361 · App. 10/601,351 · Granted Nov 22, 2005

Sea-of-cells array of transistors

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 6,967,361
App. No.
10/601,351
Granted
Nov 22, 2005
Kind
B2
Abstract

The invention concerns integrated circuits in which a MACRO is embedded in a standard cell array. One level of metal is devoted exclusively to non-local interconnect, and a layer of polysilicon is devoted to local interconnect, thereby saving significant space.

Claims (19)

1. An integrated circuit, comprising:

a logic inverter comprising:

an n-channel field effect transistor;

a p-channel field effect transistor;

a gate, common to both said n-channel field effect transistor and said p-channel field effect transistor, wherein said gate is formed in a layer of polysilicon; and

a connection between a drain of the p-channel field effect transistor and a drain of the n-channel field effect transistor formed in said same layer of polysilicon, wherein the polysilicon comprising said gate is coplanar with the polysilicon comprising said connection between said drain of the p-channel field effect transistor and said drain of the n-channel field effect transistor.

2. The integrated circuit as described in claim 1 , further comprising:

a first layer of metallization; and

a second layer of metallization, wherein the second layer of metallization comprises substantially no local interconnect.

3. The integrated circuit as described in claim 2 , wherein said second layer of metallization comprises no local interconnect.

4. The integrated circuit as described in claim 1 , further comprising:

a plurality of MACROs;

a first first layer of metallization; and

a second layer of metallization interconnecting said plurality of MACROs.

5. The integrated circuit as described in claim 4 , further comprising, no local interconnect within said second layer of metallization in at least one of said MACROs.

6. The integrated circuit as described in claim 4 , further comprising, no local interconnect within said second layer of metallization in a plurality of said MACROs.

7. The integrated circuit as described in claim 4 , further comprising, no local interconnect within said second layer of metallization in all of said plurality of MACROs.

8. The integrated circuit as described in claim 4 , wherein at least one of said MACROs is comprised by a standard cell array of the integrated circuit.

9. The integrated circuit as described in claim 8 , wherein said standard cell array comprises a row pitch and at least one MACRO has a row pitch equivalent to the row pitch of said standard cell array.

Assignments (4)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 24, 2008
From: MAGNACHIP SEMICONDUCTOR. LTD.
To: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Reel/Frame 021578/0346 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 10, 2005
From: HYNIX SEMICONDUCTOR, INC.
To: MAGNACHIP SEMICONDUCTOR, LTD.
Reel/Frame 016216/0649 →
CHANGE OF NAME Recorded Oct 12, 2004
From: HYUNDAI ELECTRONICS AMERICA
To: HYNIX SEMICONDUCTOR AMERICA INC.
Reel/Frame 015246/0599 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 12, 2004
From: HYNIX SEMICONDUCTOR AMERICA, INC.
To: HYNIX SEMICONDUCTOR INC.
Reel/Frame 015279/0556 →