Light emitting diode having an adhesive layer and a reflective layer
View Patent ↗A light emitting diode having an adhesive layer and a reflective layer and a manufacturing method thereof featured by adhering together a light emitting diode stack and a substrate having a reflective metal layer by use of a transparent adhesive layer so that the light rays directed to the reflective metal layer can be reflected therefrom to improve the brightness of the light emitting diode.
1. A light emitting diode, comprising at least:
a substrate:
a reflective layer formed over the substrate;
a first reaction layer formed over said reflective layer;
a transparent adhesive layer formed over said first reaction layer;
a second reaction layer formed over said transparent adhesive layer;
and an LED stack formed over said second reaction layer;
wherein each of the first and second reaction layers is formed to enhance an adhesion provided by the transparent adhesive layer;
wherein said transparent adhesive layer comprises at least a material selected from the group consisting of polyimide (PI), benzocyclobutene (BCB), and perfluorocyclobutane (PFCB); and
wherein each said first and second reaction layers comprises at least a material selected from the group consisting of SiNx, Ti, and Cr.
2. A light emitting diode according to claim 1 , further comprising a transparent conductive layer between said second reaction layer and said LED stack.
3. A light emitting diode according to claim 1 , wherein said reflective layer is a reflective metal layer.
4. A light emitting diode according to claim 3 , wherein said reflective metal layer comprises at least a material selected from the group consisting of In, Sn, Al, Au, Pt, Zn, Ag, Ti, Pb, Pd, Ge, Cu, AuBe, AuGe, Ni, PbSn, and AuZn.
5. A light emitting diode, comprising at least:
a reflective means;
a first reaction layer formed over said reflective means;
a transparent adhesive layer formed over said first reaction layer;
a second reaction layer formed over said transparent adhesive layer; and
an LED stack formed over said second reaction layer;
wherein the first and second reaction layers enhance adhesion provided by the transparent adhesive layer,
wherein said transparent adhesive layer comprises at least a material selected from the group consisting of polyimide (PI), benzocyclobutene (BCB), and perfluorocyclobutane (PFCB); and
wherein each said first and second reaction layers comprises at least a material selected from the group consisting of SiNx, Ti, and Cr.
6. A light emitting diode, comprising at least:
a substrate;
a reflective layer disposed on the substrate;
a first reaction layer formed on said reflective layer;
a transparent adhesive layer formed directly on said first reaction layer, said first reaction layer adhering to the transparent adhesive layer;
a second reaction layer formed directly on said transparent adhesive layer, said second reaction layer adhering to the transparent adhesive layer; and
an LED stack formed over said second reaction layer,
wherein said transparent adhesive layer comprises at least a material selected from the group consisting of polyimide (PI), benzocyclobutene (BCB), and perfluorocyclobutane (PFCB); and
wherein each said first and second reaction layers comprises at least a material selected from the group consisting of SiNx, Ti, and Cr.
7. A light emitting diode according to claim 6 , further comprising a transparent conductive layer between said second reaction layer and said LED stack.
8. A light emitting diode according to claim 6 , wherein said reflective layer is a reflective metal layer.
9. A light emitting diode according to claim 8 , wherein said reflective metal layer comprises at least a material selected from the group consisting of In, Sn, Al, Au, Pt, Zn, Ag, Ti, Pb, Pd, Ge, Cu, AuBe, AuGe, Ni, PbSn, and AuZn.