Light emitting diode array illuminant and backlight module by using the same
View Patent ↗The present invention provides a light emitting diode array illuminant and a backlight module by using the same, which comprises at least a carrier and a plurality of light emitting diodes. The carrier comprises a front surface and a back surface, and a plurality set of contacts are disposed on the front surface and back surface of the carrier. The light emitting diodes are disposed on the carrier, and are electrically connected to the contacts of each set, respectively. The illuminant provided by the light emitting diodes emits a light from a side of the carrier. The present invention further applies the light emitting diode array illuminant to a backlight module, so that it can be activated under low temperature and also protects the backlight module from over heating after it is activated.
1. A light emitting diode array illuminant, comprising:
a folded FPC plate, comprising a first join area, a second join area, and a bending area, which is connected to the first join area and the second join area, wherein the first join area comprises a plurality set of first contacts, and the second join area comprises a plurality set of second contacts; and
a plurality of light emitting diodes, disposed on the first join area and the second join area, wherein the light emitting diodes are electrically connected to the sets of first contacts and the sets of second contacts, and the illuminant provided by the light emitting diodes emits a light from a side of the folded FPC plate.
2. The light emitting diode array illuminant of claim 1 , wherein the light emitting diodes electrically connected to the sets of first contacts and the light emitting diodes electrically connected to the sets of second contacts are symmetrically disposed with each other or interleaved disposed.
3. A backlight module, comprising:
a light guide panel, comprising a light incident surface, a light emitting surface, and a light dispersing surface; and
a light emitting diode array illuminant, disposed beside the light incident surface of the light guide panel, comprising:
a carrier, wherein the carrier comprises a front surface and a back surface, and a plurality set of contacts are disposed on the front surface and the back surface of the carrier; and
a plurality of light emitting diodes, disposed on the carrier, wherein the light emitting diodes are electrically connected to the sets of contacts, respectively, and the illuminant provided by the light emitting diodes emits a light from a side of the carrier.
4. The backlight module of claim 3 , wherein the carrier comprises a Printed Circuit Board (PCB).
5. The backlight module of claim 3 , wherein the carrier comprises a flexible printed circuit (FPC) plate.
6. The backlight module of claim 5 , further comprising a carrier, wherein the FPC plate is either a single layer FPC plate or a multi-layer FPC plate.
7. The backlight module of claim 3 , wherein the light emitting diodes are symmetrically disposed with each other or interleaved disposed.
8. The backlight module of claim 3 , further comprising a reflective panel, wherein the reflective panel is disposed on the light dispersing surface.
9. A backlight module, comprising:
a light guide panel, comprising a light incident surface, a light emitting surface, and a light dispersing surface; and
a light emitting diode array illuminant, disposed beside the light incident surface of the light guide panel, comprising:
a folded FPC plate, comprising a first join area, a second join area, and a bending area, which is connected to the first join area and the second join area, wherein the first join area comprises a plurality set of first contacts, and the second join area comprises a plurality set of second contacts; and
a plurality of light emitting diodes, disposed on the first join area and the second join area, wherein the light emitting diodes are electrically connected to the sets of first contacts and the sets of second contacts, and the illuminant provided by the light emitting diodes emits a light from a side of the folded FPC plate.
10. The backlight module of claim 9 , wherein the light emitting diodes electrically connected to the sets of first contacts and the light emitting diodes electrically connected to the sets of second contacts are symmetrically disposed with each other or interleaved disposed.
11. The backlight module of claim 9 , further comprising a reflective panel, wherein the reflective panel is disposed on the light dispersing surface.