Liquid crystal display and the manufacturing method thereof
View Patent ↗A liquid crystal display device includes two parallel substrates spaced apart, a sealant forming an enclosed space with the two substrates and a liquid crystal layer forming in the enclosed space. After at least a conducting layer and/or an insulating layer of the Thin Film Transistors and the pixel electrodes thereon is deposited on the one substrate, two masks serve to at least cover the conducting layer and/or the insulating layer. As deposition is continued, at least one conducting and/or insulating wall structure with specific pattern on the one substrate is formed. Thus, contamination and degradation of the liquid crystal can be avoided and further the two substrates can be conducted without using conductive material.
1. A liquid crystal display, comprising:
two substrates, being spaced apart in parallel;
an enclosed wall structure, provided in between said two substrates, wherein the enclosed wall structure and said two substrates form a first enclosed space, wherein said enclosed wall structure is not used for adhering said two substrates;
a sealant, fanned outside said enclosed wall structure between said two substrates, wherein said sealant and said two substrates form a second enclosed space;
a liquid crystal layer, formed in said first enclosed space between said two substrates; and
at least a thin film transistor, being formed in said first enclosed space on one of said two substrates,
wherein said enclosed wall structure comprises a conductive wall.
2. The liquid crystal display as recited in claim 1 , wherein said conductive wall serves to conduct said two substrates.
3. The liquid crystal display as recited in claim 1 , wherein said sealant comprises a light hardening adhesive.
4. The liquid crystal display of claim 1 , wherein the sealant is formed only on the one of said two substrate with said enclosed wall.
5. A liquid crystal display, comprising:
two substrates, being spaced apart in parallel;
an enclosed wall structure, provided in between said two substrates, wherein the enclosed wall structure and said two substrates form a first enclosed space, wherein said enclosed wall structure is not used for adhering said two substrates;
a sealant, formed outside said enclosed wall structure between said two substrates, wherein said sealant and said two substrates form a second enclosed space;
a liquid crystal layer, formed in said first enclosed space between said two substrates; and
at least a thin film transistor, being formed in said first enclosed space on one of said two substrates,
wherein a plurality of conductive walls for conducting said two substrates are provided on said substrate that has said thin film transistors, wherein the conductive walls are located within the first enclosed space.