Curable compositions
View Patent ↗Curable compositions, such as benzoxazine-based ones, are useful in applications within the aerospace industry, such as for example as a heat curable composition for use as a matrix resin or an adhesive, and form the basis of the present invention.
1. A heat curable composition comprising:
(a) a benzoxazine component comprising
wherein o is 1–4, X is member selected from the group consisting of a direct bond (when o is 2), alkyl (when o is 1), alkylene (when o is 2–4), carbonyl (when o is 2), thiol (when o is 1), thioether (when o is 2), sulfoxide (when o is 2), and sulfone (when o is 2) , and R 1 is alkyl; and
(b) about 5 weight percent or more of a toughener component comprising acrylonitrile-butadiene co-polymer having secondary amine terminal groups.
2. A heat curable composition comprising:
(a) a benzoxazine component comprising
wherein X is selected from the group consisting of a direct bond, CH 2 , C(CH 3 ) 2 , C═O, S, S═O and O═S═O, and R 1 and R 2 are the same or different and are selected from the group consisting of methyl, ethyl, propyls and butyls; and
(b) about 5 weight percent or more of a toughener component comprising acrylonitrile-butadiene co-polymer having secondary amine terminal groups, wherein cured reaction products of the composition are capable of demonstrating at least one of a wet Tg of at least 350°F., a toughness measured by G IC of at least 1.9 in-lb./in 2 , a percent decrease in ΔH of at least 15% compared with a benzoxazine prepared from bisphenol F and aniline, and a percent decrease in wet Tg compared with dry Tg with increased toughener concentration of less than 6%.
3. A heat curable composition comprising
(a) a benzoxazine component comprising
wherein R 1 and R 2 are the same or different and are selected from the group consisting of methyl, ethyl, propyls and butyls; and
(b) about 5 weight percent or more of a toughener component comprising acrylonitrile-butadiene co-polymer having secondary amine terminal groups, wherein cured reaction products of the composition are capable of demonstrating at least one of a wet Tg of at least 350, a toughness measured by GI c of at least 1.9 in-lb./in 2 , a percent decrease in ΔH of at least 15% compared with a benzoxazine prepared from bisphenol F and aniline, and a percent decrease in dry Tg compared with wet Tg with increased toughener concentration of less than 6%.
4. A heat curable composition comprising:
(a) a benzoxazine component comprising
wherein X is selected from the group consisting of a direct bond, CH 2 , C(CH 3 ) 2 , C═O, S, S═O and O═S═O, and R 1 and R 2 are the same or different and are selected from the group consisting of methyl, ethyl, propyls and butyls; and
(b) about 5 weight percent or more of a toughener component comprising acrylonitrile-butadiene co-polymer having secondary amine terminal groups, wherein Tg and toughness measured by G IC increase as the amount of toughener in the composition increases.
5. A heat curable composition comprising:
(a) a benzoxazine component comprising
wherein R 1 and R 2 are the same or different and are selected from the group consisting of methyl, ethyl, propyls and butyls; and
(b) about 5 weight percent or more of a toughener component comprising acrylonitrile-butadiene co-polymer having secondary amine terminal groups, wherein Tg and toughness measured by GI c increase as the amount of toughener in the composition increases.
6. The heat curable composition of any one of claims 1 – 5 , having a cured density of less than 1.2 g/cc.
7. The heat curable composition of any one of claims 1 – 5 , wherein component (a) is present in an amount in the range of about 10 to about 99 percent by weight, based on the total weight of the composition.
8. An adhesive composition comprising the heat curable composition of any one of claims 1 – 5 .
9. The adhesive compositions of claim 8 , further comprising one or more of an adhesion promoter, a flame retardant, a filler, a thermoplastic additive, a reactive or unreactive diluent, and a thixotrope.
10. Cured reaction products of the adhesive composition of claim 8 .