IP Library Granted Patent US 6,953,291
Granted Patent B2
US 6,953,291 · App. 10/607,982 · Granted Oct 11, 2005

Compact package design for vertical cavity surface emitting laser array to optical fiber cable connection

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Quick Facts
Patent No.
US 6,953,291
App. No.
10/607,982
Granted
Oct 11, 2005
Kind
B2
Abstract

A hermetically sealed, opto-electronic array housing assembly having a ceramic base, electrical connectors, a metal can, and a glass window. The glass window can support a micro-lens array. The metal can receives the glass window. The electrical impedance of the electrical connectors is beneficially carefully controlled to enable high-speed data communications. A multi-element optical fiber connector can provide for optical communications to and/or from an opto-electronic array contained within the housing.

Claims (37)

1. An opto-electronic housing, comprising:

a substantially planar submount having a plurality of conductive traces on a planar surface thereof;

a metallic can attached to the planar surface of said submount forming a cavity having the planar surface of said submount on a first surface thereof and said can on at least a second surface thereof, said cavity having an opening for light to pass through; and

a transparent window in or covering said opening and attached to said can;

wherein said plurality of conductive traces extend along the planar surface of the submount from inside the cavity to beyond the can; and

wherein said cavity is hermetically sealed and comprises said window on a first surface, said submount on an opposing second surface, and said can on the surfaces interconnecting said window and said submount.

2. The opto-electronic housing according to claim 1 , wherein said submount includes ceramic.

3. The opto-electronic housing according to claim 1 , further including a micro lens array on the transparent window, wherein said micro lens array includes individual lens elements.

4. The opto-electronic housing according to claim 1 , further including an opto-electronic array in said cavity, wherein said opto-electronic array is electrically connected to said conductive traces.

5. The opto-electronic housing according to claim 4 , wherein said opto-electronic array includes a vertical cavity surface emitting laser (VCSEL).

6. The opto-electronic housing according to claim 4 , wherein said opto-electronic array includes a photo detector.

7. The opto-electronic housing according to claim 4 , wherein said opto-electronic array includes integrated lenses.

8. The opto-electronic housing according to claim 1 , wherein a plurality of heat conductive plugs pass through said submount.

9. An opto-electronic device, comprising:

a substantially planar submount comprising substantially planar surface;

a plurality of thru-via conductive contacts passing through said planar surface;

a plurality of opto-electronic devices mounted directly or indirectly on said submount, wherein each of said plurality of opto-electronic devices is in communication with at least one of said conductive contacts;

a metallic can attached to the planar surface of said submount and forming a cavity, wherein said can includes an opening for light to pass through, and wherein said cavity extends over said opto-electronic devices and said conductive contacts; and

a transparent window in or covering said opening and attached to said can;

wherein said cavity is hermetically sealed and comprises said window on a first surface, said submount on an opposing surface, and said can on the surfaces interconnecting said window and said submount.

10. The opto-electronic housing according to claim 9 , wherein said submount includes ceramic.

11. The opto-electronic housing according to claim 9 , further including a micro lens array on the transparent window, wherein said micro lens array includes individual lens elements.

12. The opto-electronic housing according to claim 9 , further including an opto-electronic array in said cavity that is electrically connected to said conductive contacts.

13. The opto-electronic housing according to claim 12 , wherein said opto-electronic array includes a vertical cavity surface emitting laser (VCSEL).

14. The opto-electronic housing according to claim 12 , wherein said opto-electronic array includes a photo detector.

15. The opto-electronic housing according to claim 12 , wherein the opto-electronic array includes integrated lenses.

16. An opto-electronic housing, comprising:

a substantially planar submount holding an opto-electronic array having a plurality of opto-electronic devices;

a metallic support comprising a central body, parallel legs, and guide pins, wherein said support is attached to said substantially planar submount and forms a cavity with an opening for light to pass through; and

a transparent window in or covering said opening and attached to said support, wherein a hermetic seal is formed, and wherein a cavity is formed, said cavity comprising said window on a first surface, said submount on an opposing surface, and said support on the surfaces interconnecting said window and said submount;

wherein a flexible ribbon-type optical cable having a plurality of optical fibers and openings that align with the guide pins can be mounted between said parallel legs, said guide pins fitting into said openings when the flexible ribbon-type optical cable is attached to said support.

17. The opto-electronic housing according to claim 16 , wherein said opto-electronic array includes discrete optical elements, and wherein the optical elements optically align with said plurality of optical fibers when said flexible optical cable is attached to said support.

18. The opto-electronic housing according to claim 16 , wherein the support is monolithic.

19. The opto-electronic housing according to claim 1 , wherein said second surface further comprises a plurality of opto-electronic devices.

20. The opto-electronic housing according to claim 1 , wherein said transparent window is bounded laterally by said metallic can.

21. The opto-electronic housing according to claim 9 , wherein said transparent window is bounded laterally by said metallic can.

22. The opto-electronic housing according to claim 16 , wherein said support is welded to said substantially planar submount.

Assignments (4)
PATENT RELEASE AND REASSIGNMENT Recorded Jul 5, 2022
From: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
To: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.; KAILIGHT PHOTONICS, INC.; COADNA PHOTONICS, INC.; OPTIUM CORPORATION; FINISAR CORPORATION; II-VI OPTICAL SYSTEMS, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; II-VI DELAWARE, INC.; II-VI OPTOELECTRONIC DEVICES, INC.; PHOTOP TECHNOLOGIES, INC.
Reel/Frame 060574/0001 →
SECURITY INTEREST Recorded Jul 1, 2022
From: II-VI INCORPORATED; II-VI DELAWARE, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; PHOTOP TECHNOLOGIES, INC.; COHERENT, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 060562/0254 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 1, 2020
From: FINISAR CORPORATION
To: II-VI DELAWARE, INC.
Reel/Frame 052286/0001 →
NOTICE OF GRANT OF SECURITY INTEREST IN PATENTS Recorded Sep 25, 2019
From: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.; KAILIGHT PHOTONICS, INC.; COADNA PHOTONICS, INC.; OPTIUM CORPORATION; FINISAR CORPORATION; II-VI OPTICAL SYSTEMS, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; II-VI DELAWARE, INC.; II-VI OPTOELECTRONIC DEVICES, INC.; PHOTOP TECHNOLOGIES, INC.
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 050484/0204 →