Semiconductor apparatus of which reliability of interconnections is improved and manufacturing method of the same
View Patent ↗A semiconductor apparatus includes an under layer, a first insulating layer and a first conductive portion. The under layer is formed above a substrate. The first insulating layer is formed on the under layer. The first conductive portion is formed in a first concave portion which passes through the first insulating layer to the under layer. The first conductive portion includes a first barrier metal layer and a first metal portion. The first barrier metal layer is formed on a side wall and a bottom surface of the first concave portion. The first metal portion is formed on the first barrier metal layer such that the rest of the first concave portion is filled with the first metal portion. The first metal portion includes a first alloy including copper and aluminium.
1. A semiconductor apparatus comprising:
an under layer formed above a substrate;
a first insulating layer formed on said under layer; and
a first conductive portion formed in a first concave portion which passes through said first insulating layer to said under layer;
wherein said first conductive portion includes:
a first barrier metal layer formed on a side wall and a bottom surface of said first concave portion; and
a first metal portion formed on said first barrier metal layer such that the rest of said first concave portion is filled with said first metal portion; and
said first metal portion includes a first alloy comprising copper and aluminum;
wherein a containing percentage of aluminum in said first alloy is 0.1 to 10 atm %.
2. The semiconductor apparatus according to claim 1 , further comprising:
a second insulating layer formed on said first insulating layer and said first conductive portion; and
a second conductive portion formed in a second concave portion which passes through said second insulating layer to said first conductive portion;
wherein said second conductive portion includes:
a second barrier metal layer formed on a side wall and a bottom surface of said second concave portion; and
a second metal portion formed on said second barrier metal layer such that the rest of said second concave portion is filled with said second metal portion;
said second metal portion includes a second alloy comprising copper and aluminum;
said first conductive portion is one of an interconnection and a via,
said second conductive portion is one of an interconnection and a via, and
a containing percentage of aluminum in said second alloy is 0.1 to 10 atm %.
3. The semiconductor apparatus according to claim 2 wherein a ratio of an area of larger one of said first conductive portion and said second conductive portion to an area of the other is equal to or greater than 20.
4. The semiconductor apparatus according to claim 1 wherein a resistance of said first conductive portion is lower than that of said first conductive portion when said first metal portion consists of aluminum.
5. The semiconductor apparatus according to claim 4 wherein an aspect ratio of said first concave portion is equal to or greater than 2.
6. The semiconductor apparatus according to claim 5 wherein a width of said first conductive portion is equal to or less than 0.18 μm,
a depth of said first conductive portion is equal to or greater than 0.3 μm,
a thickness of said first barrier metal layer is equal to or greater than 0.01 μm, such that said first metal portion is formed in said first concave portion.
7. The semiconductor apparatus according to claim 1 , wherein a containing percentage of aluminum in said first alloy is 5 to 10 atm %.
8. The semiconductor apparatus according to claim 1 , wherein said barrier metal layer comprises at least one of Ti, TiN, Ta, TaN and WN.