Semiconductor module and power conversion device
View Patent ↗One method of achieving the above subjects is by connecting a block member 14 , which is connected to the side opposite to that of a semiconductor chip 11 having insulating substrates 12 and 13 connected to the top and bottom of the semiconductor chip 11 , to a block member 15 across an laminated structure constituted by the semiconductor chip 11 and the insulating substrates 12 and 13.
1. A semiconductor module comprising:
a semiconductor device having electrodes at both surfaces thereof;
insulating substrates electrically connected to respective ones of said electrodes, each of said insulating substrates being provided with wiring electrically connected to corresponding electrodes of said semiconductor device, whereby said semiconductor device and said insulating substrate form a laminated structure section;
a block member made of electrically conductive metal;
first means for connecting one face of said block member to one face of said laminated structure section;
a heat releasing structure provided on the other face of said block member;
a metallic thermal-conductive member;
second means for connecting said thermal conductive member to the other face of the laminated structure section within a cavity formed in said thermal-conductive member;
wherein, each of said first and second means consists of an electrically conductive adhesive;
wherein, said thermal-conductive member has a portion that surrounds the cavity and is connected to said block member;
wherein, the laminated structure section is confined within the cavity in such a manner that side faces of the laminated structure section do not touch the block member and the thermal-conductive member;
whereby a heat stream from the top of the laminated structure is released through the thermal-conductive member to said block member and said heat releasing structure.
2. A semiconductor module according to claim 1 , wherein said electrically conductive adhesive comprises metallic pieces or metallic particles mixed with resin.
3. A semiconductor module according to claim 2 , wherein said metallic pieces or said metallic particles have needle-like or petal-like protrusions and said protrusions are in close contact with each other in said resin.