Sliders bonded by a debondable encapsulant containing styrene and butadiene polymers
View Patent ↗The invention relates generally to the bonding of one or more sliders in styrene and butadiene polymers. More particularly, the invention relates to planarized slider assemblies formed by using debondable solid encapsulants comprised of styrene and butadiene polymers. The invention also relates to methods that use such encapsulants in conjunction with resists to produce magnetic head sliders having patterned air-bearing surfaces.
1. A slider assembly comprising a plurality of sliders for a data storage system bonded by a debondable solid encapsulant, wherein the encapsulant is comprised of a blend of styrene and butadiene polymers, of a weight ratio of about 19:1 to about 17:3, or about 9:1, or about 10% polybutadiene, wherein at least some sliders have encapsulant-free surfaces which are coplanar to each other.
2. The slider assembly of claim 1 , having a contiguous planar surface comprised of at least one encapsulant region and containing the coplanar slider surfaces.
3. The slider assembly of claim 2 , wherein the sliders are arranged in an array.
4. The slider assembly of claim 3 , wherein the array is a rectilinear array.
5. The slider assembly of claim 4 , wherein the sliders do not contact each other.
6. The slider assembly of claim 4 , wherein the coplanar surfaces of the sliders are each an air-bearing surface.
7. The slider assembly of claim 6 , further comprising a substrate in contact with the air-bearing surfaces.
8. The slider assembly of claim 7 , wherein the substrate is comprised of a laminate of a flexible tape and an adhesive, wherein the adhesive is in contact with the air-bearing surfaces.
9. The slider assembly of claim 8 , wherein the adhesive is a pressure sensitive adhesive.
10. The slider assembly of claim 8 , wherein the adhesive preferentially adheres to the tape over the air-bearing surfaces.
11. The slider assembly of claim 6 , further comprising a resist layer on the air-bearing surfaces, wherein the encapsulant is mechanically stable upon exposure to the resist layer or any component thereof.
12. The slider assembly of claim 11 , wherein the encapsulant is subject to solvation by a solvent not found in the resist layer.
13. The slider assembly of claim 4 , wherein the encapsulant does not substantially outgas under vacuum.
14. The slider assembly of claim 4 , further comprising a carrier attached to the encapsulant and/or at least one slider, wherein the carrier does not cover any of the coplanar slider surfaces.
15. The slider assembly of claim 4 , wherein the styrene and butadiene polymers are present is a weight ratio of about 19:1 to about 17:3.
16. The slider assembly of claim 15 , wherein the styrene and butadiene polymers are present in a weight ratio of about 9:1.
17. The slider assembly of claim 1 , wherein the encapsulant blend provides markedly improved performance, with improved toughness and filling characteristics.