Die sorter with reduced mean time to convert
An adapter frame has channels that hold multiple die carriers in each channel. The die carriers, such as 2″×2″ or 4″×4″ waffle packs or GEL-PAK die carriers, slide into the channels and are secured by a spring clip retention mechanism. In other embodiments, the adapter frame has molded individual cavities to hold single die carriers. The adapter frame has the same exterior dimensions as a conventional wafer frame. This allows the adapter frame to be handled at the die sorter output in the same or similar manner as output wafer frames, thereby eliminating the need to change handlers when switching the output from a wafer frame to a specific die carrier.
1. An output adapter frame for a die sorter, comprising:
at least one channel along the upper surface of the output adapter frame, wherein the channel holds a plurality of die carriers and has an open end and a closed end;
a barrier located at the closed end of each channel; and
a retention mechanism for each of the plurality of die carriers, wherein the retention mechanism is along a side of the channel and actively biases the die carrier against the opposing side of the channel.
2. The output adapter frame of claim 1 , wherein the output frame has the same physical exterior dimensions as a SEMI standard film frame design for an 8-inch or 12-inch wafer.
3. The output adapter frame of claim 1 , wherein the die carriers are waffle packs or GEL-PAK die carriers.
4. The output adapter frame of claim 1 , wherein the die carriers are approximately 2″ by 2″.
5. The output adapter frame of claim 4 , further comprising four channels in parallel with each other.
6. The output adapter frame of claim 5 , wherein the four channels comprise two outer channels capable of holding two 2″ by 2″ die carriers each and two inner channels capable of holding four 2″ by 2″ die carriers each.
7. The output adapter frame of claim 1 , wherein the die carriers are approximately 4″ by 4″.
8. The output adapter frame of claim 7 , wherein the at least one channel is a single channel.
9. The output adapter frame of claim 8 , wherein the single channel is capable of holding two 4″ by 4″ die carriers.
10. The output adapter frame of claim 1 , wherein the output frame and the at least one channel are a unitary structure.
11. The output adapter frame of claim 1 , wherein the retention mechanism is a spring clip.
12. An output adapter frame for use with a die sorter, comprising:
a plurality of approximately square recesses, each square recess capable of holding one square die carrier, wherein the output adapter frame is handled in the same manner during the die sorting process as a SEMI standard output wafer frame, wherein the output frame has the same physical exterior dimensions as a SEMI standard film frame design for an 8-inch or 12-inch wafer.
13. An output adapter frame for use with a die sorter, comprising:
a plurality of approximately square recesses, each square recess capable of holding one square die carrier, wherein the output adapter frame is handled in the same manner during the die sorting process as a SEMI standard output wafer frame, wherein the die carriers are approximately 2″ by 2″ or 4″ by 4″.
14. An output adapter frame for use with a die sorter, comprising:
a plurality of approximately square recesses, each square recess capable of holding one square die carrier, wherein the output adapter frame is handled in the same manner during the die sorting process as a SEMI standard output wafer frame, wherein the adapter frame is a unitary structure.
15. A die sorter for sorting die contained in square die carriers, comprising:
an input wafer cassette;
a plurality of wafer frames containing the die, wherein the wafer frames are capable of being loaded and unloaded from the input wafer cassette;
a first wafer frame handler for loading and unloading the wafer frames;
an output wafer cassette;
a plurality of adapter frames, wherein the adapter frames are capable of being loaded and unloaded from the output wafer cassette, and wherein the adapter frames comprise at least one recess capable of holding a plurality of die carriers having an open end and a closed end and at least one retention mechanism that actively biases the die carriers against an opposing side of the recess;
a second wafer frame handler for loading and unloading the adapter frames; and
a die sorting mechanism to sort the die onto the die carriers on the adapter frames.
16. The die sorter of claim 15 , wherein the die carriers are waffle packs or GEL-PAK die carriers.
17. The die sorter of claim 15 , wherein the adapter frames each comprise a plurality of parallel recesses, each recess capable of holding a plurality of the die carriers.
18. The die sorter of claim 17 , wherein the adapter frames each further comprise a retention mechanism along one side of the recesses.
19. The die sorter of claim 15 , wherein the adapter frames have the same physical exterior dimensions as a SEMI standard film frame design for 8-inch or 12-inch wafers.