IP Library Granted Patent US 7,276,736
Granted Patent B2
US 7,276,736 · App. 10/616,783 · Granted Oct 2, 2007

Wavelength-converting casting composition and white light-emitting semiconductor component

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Quick Facts
Patent No.
US 7,276,736
App. No.
10/616,783
Granted
Oct 2, 2007
Kind
B2
Abstract

The wavelength-converting casting composition is based on a transparent epoxy casting resin with a luminous substance admixed. The composition is used in an electroluminescent component having a body that emits ultraviolet, blue or green light. An inorganic luminous substance pigment powder with luminous substance pigments is dispersed in the transparent epoxy casting resin. The luminous substance is a powder of Ce-doped phosphors and the luminous substance pigments have particle sizes ≦20 μm and a mean grain diameter d 50 ≦5 μm.

Claims (28)

1. Light emitting semiconductor body for use in an LED housing,

said semiconductor body being provided with a layer comprising a wavelength-converting casting composition; and

said casting composition comprising luminous substance particles;

said luminous substance particles comprising luminous substance pigments selected from the group consisting of garnets doped with rare earths; thiogallates doped with rare earths; aluminates doped with rare earths; and orthohsilicates doped with rare earths; and

said luminous substance pigments having grain sizes ≦20 μm and a median diameter ≦5 μm, wherein 50% of the pigments have a grain diameter greater than said median diameter and 50% of the pigments have a grain diameter less than said median diameter.

2. Semiconductor body according to claim 1 , wherein the median diameter of said luminous substance pigments is between 1 and 2 micrometers.

3. Semiconductor body according to claim 1 , wherein said luminous substance pigments contain Ce-doped garnet material.

4. Semiconductor body according to claim 1 , wherein said luminous substance pigments contain YAG:Ce material.

5. Semiconductor body according to claim 1 , wherein the iron content in the casting composition is ≦20 ppm.

6. Semiconductor body according to claim 1 , wherein the luminous substance pigments are provided with a silicone coating.

7. Semiconductor body according to claim 1 , wherein said luminous substance pigments convert radiation from the ultraviolet, blue or green spectral range into light with a relatively longer wavelength.

8. Semiconductor body according to claim 1 , wherein said layer containing light-scattering particles.

9. Semiconductor body according to claim 1 , wherein said semiconductor body is adapted to emit radiation in a blue spectral range having a maximum luminescence intensity at a wavelength between 420 nm and 460 nm.

10. Semiconductor body according to claim 1 , wherein the casting composition further comprises a transparent resin.

11. Semiconductor body according to claim 10 , wherein the transparent resin is an epoxy resin.

12. Light emitting semiconductor body for use in an LED housing,

said semiconductor body being provided with a layer comprising a wavelength-converting casting composition; and

said casting composition comprising luminous substance particles;

said luminous substance particles comprising luminous substance pigments from Ce-doped phosphors; and

said luminous substance pigments having grain sizes ≦20 μm, and a median diameter ≦5 μm, wherein 50% of the pigments have a grain diameter greater than said median diameter and 50% of the pigments have a grain diameter less than said median diameter.

13. Semiconductor body according to claim 12 , wherein the median diameter of said luminous substance pigments is between 1 and 2 micrometers.

14. Semiconductor body according to claim 12 , wherein the iron content in the casting composition is ≦20 ppm.

15. Semiconductor body according to claim 12 , wherein the luminous substance pigments are provided with a silicone coating.

16. Semiconductor body according to claim 12 , wherein said luminous substance pigments convert radiation from the ultraviolet, blue or green spectral range into light with a relatively longer wavelength.

17. Semiconductor body according to claim 12 , wherein said layer containing light-scattering particles.

18. Semiconductor body according to claim 12 , wherein said semiconductor body is adapted to emit radiation in a blue spectral range having a maximum luminescence intensity at a wavelength between 420 nm and 460 nm.

19. Semiconductor body according to claim 12 , wherein the casting composition further comprises a transparent resin.

20. Semiconductor body according to claim 19 , wherein the transparent resin is an epoxy resin.

Assignments (6)
TO CORRECT THE ADDRESS OF THE ASSIGNEE, OSRAM GMBH Recorded Apr 22, 2008
From: OSRAM OPTO SEMICONDUCTORS GMBH
To: OSRAM GMBH
Reel/Frame 020837/0132 →
CORRECT THE ADDRESS OF THE ASSIGNEE OSRAM GMBH Recorded Apr 16, 2008
From: OSRAM OPTO SEMICONDUCTORS GMBH
To: OSRAM GMBH
Reel/Frame 020808/0875 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 14, 2006
From: SIEMENS AKTIENGESELLSCHAFT
To: OSRAM OPTO SEMICONDUCTORS GMBH & CO. OHG
Reel/Frame 017335/0254 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 15, 2006
From: HOHN, KLAUS; DEBRAY, ALEXANDRA; SCHLOTTER, PETER; SCHMIDT, RALF; SCHNEIDER, JURGEN
To: SIEMENS AKTIENGESELLSCHAFT
Reel/Frame 017262/0047 →
CHANGE OF NAME Recorded Jan 31, 2005
From: OSRAM OPTO SEMICONDUCTORS GMBH & CO. OHG
To: OSRAM OPTO SEMICONDUCTORS GMBH
Reel/Frame 015629/0470 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 31, 2005
From: OSRAM OPTO SEMICONDUCTORS GMBH
To: OSRAM GMBH
Reel/Frame 015629/0627 →