Slurry for chemical mechanical polishing
View Patent ↗The present invention relates to a slurry for chemical mechanical polishing, which contains a silica polishing material, an oxidizing agent, a benzotriazole-based compound, a diketone and water.
1. A slurry for chemical mechanical polishing, which comprises a silica polishing material, an oxidizing agent, a benzotriazole-based compound, a diketone and water, and
wherein said diketone is at least one type of a compound selected from the group consisting of 1,2-diketones, 1,3-diketones and 1,4-diketones, and
wherein a content weight ratio of said diketone to said benzotriazole-based compound (diketone/benzotriazole-based compound) is not less than 0.05 but not greater than 50.
2. A slurry for chemical mechanical polishing according to claim 1 , wherein a value of a pH is in a range of 1 to 7.
3. A slurry for chemical mechanical polishing according to claim 1 , wherein said silica polishing material is colloidal silica.
4. The slurry for chemical mechanical polishing according to claim 1 , wherein a content weight ratio of said diketone to said benzotriazole-based compound (diketone/benzotriazole-based compound) is not less than 0.1 but not greater than 10.
5. The slurry for chemical mechanical polishing according to claim 1 , wherein the content of the silica polishing material is not less than 1 wt %.
6. The slurry for chemical mechanical polishing according to claim 1 , wherein the content of the silica polishing material is not less than 1 wt % but not greater than 10 wt %.
7. The slurry for chemical mechanical polishing according to claim 1 , wherein the content of the benzotriazole-based compound is not less than 0.001 wt % but not greater than 0.5 wt %.
8. The slurry for chemical mechanical polishing according to claim 1 , wherein the content of the diketone is not less than 0.001 wt % but not greater than 5 wt %.