LCT-epoxy polymers with HTC-oligomers and method for making the same
View Patent ↗The present invention relates to homogenous LCT-epoxy polymers with oligomers containing grafted nano-sized HTC-materials and methods for making the same. The homogenous LCT-epoxy polymers with oligomers containing grafted nano-sized HTC-materials comprise HTC-oligomer sub-structures evenly dispersed and essentially completely co-reacted with the LCT-epoxy sub-structures, where the HTC-oligomer sub-structures are organically bonded to the LCT-epoxy sub-structures. This produces homogenous LCT-epoxy polymers with oligomers containing grafted nano-sized HTC-materials that are substantially free of particle wetting and micro-void formation, with improved thermal conductivity properties without compromising on other desired structural integrities.
1. A method of making homogenous LCT-epoxy polymers with HCT-oligomers having a dielectric strength of at least 1.2 kV/mil comprising:
grafting at least one functionalized organic group onto at least one nano-sized HTC-material to produce HTC-oligomer product;
reacting said HTC-oligomer product with at least one LCT-epoxy resin under sufficient conditions to form a uniform dispersion and an essentially complete co-reactivity of said HTC-oligomer product with said at least one LCT-epoxy resin, wherein a mixture is formed; and
curing said mixture to produce said homogenous LCT-epoxy polymers with HTC-oligomers;
wherein the amount of said HTC-oligomer product to said at least one LCT-epoxy resin comprises a ratio of between 1:4 and 3:1 by weight;
whereby the homogeneous nature of said LCT-epoxy polymers enables the dielectric strength of at least 1.2 kV/mil.
2. The method of claim 1 , wherein said at least one nano-sized HTC-material comprises at least one of alumina, silica and a metal oxide.
3. The method of claim 2 , wherein said metal oxide is magnesium oxide.
4. The method of claim 1 , wherein the grafting said at least one functionalized organic group onto said at least one nano-sized HTC-material is performed by at least one of a silane grafting and a free radical grafting.
5. The method of claim 1 , wherein the HTC-oligomer portions of said homogenous LCT-epoxy polymers with HTC-oligomers is 20–50% by weight.
6. The method of claim 1 , wherein reacting said HTC-oligomer product with said at least one LCT-epoxy further comprises warming until said mixture is clear.
7. The method of claim 1 , further comprising mixing at least one anhydriding agent with at least one of said at least one LCT-epoxy resin and said HTC-oligomer product, wherein said homogenous LCT-epoxy polymers with HTC-oligomers are a homogenous LCT-epoxy anhydride polymers with HTC-oligomers.
8. The method of claim 7 , wherein said anhydriding agent is taken from the group consisting of 1-methylhexahydrophthalic anhydride and 1-methyltetrahydrophthalic anhydride.
9. The method of claim 7 , wherein said anhydriding agent is approximately 20–40% by weight of said homogenous LCT-epoxy polymers with HTC-oligomers.
10. The method of claim 1 , further comprising mixing at least one vinyl agent with at least one of said at least one LCT-epoxy resin and said HTC-oligomer product, wherein said homogenous LCT-epoxy polymers with HTC-oligomers are a homogenous LCT-epoxy vinyl polymers with HTC-oligomers.
11. The method of claim 10 , wherein said vinyl agent is p-vinylphenylglycidylether.
12. The method of claim 10 , wherein said vinyl portion is approximately 4–16% by weight of said homogenous LCT-epoxy polymers with HTC-oligomers.
13. The method of claim 1 , wherein said mixture is added to an electrical insulator as a coating before curing.
14. A method of making homogenous LCT-epoxy polymers with HTC-oligomers having a dielectric strength of at least 1.2 kV/mil coated on at least one electrical insulator comprising the steps of:
grafting at least one functionalized organic group onto at least one nano-sized HTC-material to produce HTC-oligomer product;
reacting said HTC-oligomer product with at least one LCT-epoxy resin wherein a mixture is formed;
warming said mixture under sufficient conditions to form a uniform dispersion and an essentially complete co-reactivity of said HTC-oligomer product with said at least one LCT-epoxy resin;
impregnating said mixture onto said electrical insulator; and
curing said mixture to produce said homogenous LCT-epoxy polymers with HTC-oligomers;
wherein the amount of said HTC-oligomer product to said at least one LCT-epoxy resin comprises a ratio of between 1:4 and 3:1 by weight;
whereby the homogeneous nature of said LCT-epoxy polymers enables the dielectric strength of at least 1.2 kV/mil.
15. The method of claim 14 , further comprising mixing at least one anhydriding agent with at least one of said at least one LCT-epoxy resin and said HTC-oligomer product, wherein said homogenous LCT-epoxy polymers with HTC-oligomers are a homogenous LCT-epoxy anhydride polymers with HTC-oligomers.
16. The method of claim 14 , further comprising mixing at least one vinyl agent with at least one of said at least one LCT-epoxy resin and said HTC-oligomer product, wherein said homogenous LCT-epoxy polymers with HTC-oligomers are a homogenous LCT-epoxy vinyl polymers with HTC-oligomers.
17. The method of claim 14 , wherein said electrical insulator is a mica/glass insulating tape.
18. Homogenous LCT-epoxy polymers with HTC-oligomers comprising:
at least one HTC-oligomer sub-structure containing at least one nano-sized HTC-material grafted thereto;
at least one LCT-epoxy sub-structure;
a thermal conductivity in the transverse direction of at least 0.50 W/mK and in the thickness direction of at least 0.99 W/mK in an environment of 25° C.; and
a dielectric strength of at least 1.2 kV/mil;
wherein said HTC-oligomer sub-structure is organically bonded to said LCT-epoxy substructure;
wherein approximately 20–75% by weight of said homogenous LCT-epoxy polymers with HTC-oligomers is said HTC-oligomer sub-structure; and
wherein said homogenous LCT-epoxy polymers with HTC-oligomers are substantially free of particle wetting and micro-void formation;
whereby the homogeneous nature of said LCT-epoxy polymers enables the dielectric strength of at least 1.2 kV/mil.
19. The homogeneous LCT-epoxy polymers with HTC-oligomers of claim 18 , wherein said at least one nano-sized HTC-material comprises at least one of an alumina, a silica and a metal oxide.
20. The homogeneous LCT-epoxy polymers with HTC-oligomers of claim 18 , wherein said homogenous LCT-epoxy polymers with HTC-oligomers contain at least one anhydride, and wherein said anhydride portion is approximately 20–40% by weight of said homogenous LCT-epoxy polymers with HTC-oligomers.
21. The homogeneous LCT-epoxy polymers with HTC-oligomers of claim 18 , wherein said homogenous LCT-epoxy polymers with HTC-oligomers contain at least one vinyl, and wherein said vinyl portion is approximately 4–16% by weight of said homogenous LCT-epoxy polymers with HTC-oligomers.
22. The homogeneous LCT-epoxy polymers with HTC-oligomers of claim 18 , wherein said homogenous LCT-epoxy polymers with HTC-oligomers are integrally formed with at least one electrical insulator.