Micromechanical component
A component having a surface micromechanical structure containing both movable elements and immovable elements, and a method of manufacturing same are described. The surface micromechanical structure of the component is produced in a functional layer, which is connected to a substrate via at least one electrically non-conductive first insulation layer and at least one first sacrificial layer. The movable elements of the surface micromechanical structure are exposed by removing the first sacrificial layer. The first insulation layer is made of a material which is not substantially attacked by the process of removing the first sacrificial layer. Thus the removal of the sacrificial layer may be limited in a design-controlled manner. At the same time, a reliable electrical insulation of the surface micromechanical structure with respect to the substrate of the component and a reliable mechanical fastening of the immovable elements of the surface micromechanical structure to the substrate are ensured.
1. A component, comprising:
a functional layer;
a surface micromechanical structure produced in the functional layer and including movable elements and immovable elements;
at least one electrically non-conductive first insulation layer;
at least one first sacrificial layer;
an electroconductive layer that is structured and that is contactingly situated vertically between the at least one electrically non-conductive first insulation layer and the at least one first sacrificial layer; and
a substrate to which is connected the functional layer via the at least one electrically non-conductive first insulation layer and the at least one first sacrificial layer,
wherein:
the movable elements are exposed by partially removing the at least one first sacrificial layer in the area of the movable elements,
the at least one electrically non-conductive first insulation layer includes a material that is substantially not attacked in the removing of the at least one first sacrificial layer,
in a first area of the immovable elements the functional layer is in direct contact with the electroconductive layer and in a second area the functional layer is in direct contact with the at least one first sacrificial layer, and
the component is configured to perform an intended functionality of the component.
2. The component of claim 1 , wherein the component comprises a sensor and the intended functionality includes sensing by the sensor.
3. The component as recited in claim 1 , further comprising:
at least one membrane layer arranged over the surface micromechanical structure, the at least one membrane layer being mechanically connected to the substrate via at least one of the immovable elements;
at least one second sacrificial layer arranged between the functional layer and the at least one membrane layer; and
at least one second insulation layer arranged between the at least one of the immovable elements and the at least one membrane layer, wherein:
the movable elements are exposed by removing the at least one second sacrificial layer, and
the at least one second insulation layer includes a material that is not substantially attacked by the removing of the at least one second sacrificial layer.
4. The component as recited in claim 3 , wherein:
the at least one electrically non-conductive first insulation layer and the at least one second insulation layer are located only in areas of the immovable elements.
5. The component as recited in claim 3 , wherein:
the at least one second sacrificial layer is removed at least in areas of the immovable elements, and
the at least one membrane layer in the areas is in direct contact with the at least one second insulation layer.
6. The component as recited in claim 3 , wherein:
the at least one of the immovable elements includes at least one electrode, and
the at least one electrode is electrically contactable via the at least one membrane layer in that the at least one second insulation layer has at least one contact hole in an area of the at least one electrode through which the at least one membrane layer is in direct contact with the at least one electrode.
7. The component as recited in claim 3 , wherein:
the at least one first sacrificial layer and the at least one second sacrificial layer include silicon oxide, the silicon oxide being removed using an HF etching medium, and
the at least one electrically non-conductive first insulation layer and the at least one second insulation layer include one of silicon nitride and silicon carbide.
8. The component as recited in claim 3 , wherein:
the at least one electrically non-conductive first insulation layer and the at least one second insulation layer include silicon nitride having a silicon content greater than 42%.
9. A component, comprising:
a functional layer;
a surface micromechanical structure produced in the functional layer and including movable elements and immovable elements;
at least one electrically non-conductive first insulation layer;
at least one first sacrificial layer; and
a substrate to which is connected the functional layer via the at least one electrically non-conductive first insulation layer and the at least one first sacrificial layer,
wherein:
the movable elements are exposed by partially removing the at least one first sacrificial layer in the area of the movable elements,
the at least one electrically non-conductive first insulation layer includes a material that is substantially not attacked in the removing of the at least one first sacrificial layer, and
the component includes at least one area where:
the at least one electrically non-conductive first insulation layer is arranged over the substrate;
a conductive layer is arranged over the at least one electrically non-conductive first insulation layer; and
the at least one first sacrificial layer is arranged over the conductive layer,
in a first area of the immovable elements the functional layer is in direct contact with the conductive layer and in a second area the functional layer is in direct contact with the at least one first sacrificial layer, and
the component is configured to perform an intended functionality of the component.
10. The component of claim 9 , wherein the component comprises a sensor and the intended functionality includes sensing by the sensor.