Method for shielding integrated circuit devices
View Patent ↗A high reliability radiation shielding integrated circuit device comprising a plurality of package layers; a radiation shielding lid or base coupled to the plurality of package layers; wherein the circuit die are shielded from receiving an amount of radiation greater than the total dose tolerance of the circuit die. An integrated circuit device for use in high reliability applications. The integrated circuit device is designed to be highly reliable and protect integrated circuit die from failing or becoming unreliable due to radiation, mechanical forces, thermal exposure, or chemical contaminates.
1. A method of shielding a space radiation shielded integrated circuit device, wherein the space radiation shielded integrated circuit device comprises a plurality of circuit components, and is adapted for use in space, comprising:
forming a first package layer comprising a first circuit package, a copper-tungsten radiation shielding base, a first substrate, a first circuit die, a first lid, whereby the copper-tungsten radiation shielding base shields a bottom portion of the space radiation shielded integrated circuit device against incident radiation;
attaching the first circuit die to the first substrate using cyanate ester;
soldering the first circuit package to the copper-tungsten radiation shielding base, using a high-temperature copper-silver solder;
attaching the first substrate to the first circuit package, using cyanate ester;
soldering the first lid to the first package layer, using a high-temperature gold-tin solder;
forming a second package layer comprising a second substrate, a second circuit package, a second circuit die and a second copper-tungsten radiation shielding base;
attaching the second circuit die to the second substrate, using cyanate ester
soldering the second copper-tungsten radiation shielding base to the second circuit package, using a high-temperature copper-silver solder
attaching the second substrate to the second circuit package, using cyanate ester, and;
soldering a top of the second package layer to a bottom of the first package layer using a high-temperature gold-tin solder, thereby forming electrical interconnects, whereby the first package layer and the second package layer are in electrical communication.
2. The method of shielding the space radiation shielded integrated circuit device of claim 1 further comprising forming the first lid from a high Z material.
3. The method of shielding the space radiation shielded integrated circuit device of claim 1 further comprising forming the copper-tungsten radiation shielding base from a high Z material.
4. The method of shielding the space radiation shielded integrated circuit device of claim 1 wherein the first circuit die receives an amount of radiation less than the total dose tolerance of the first circuit die.
5. The method of shielding the space radiation shielded integrated circuit device of claim 1 wherein the second circuit die receives an amount of radiation less than the total dose tolerance of the second circuit die.