Lead frame for resin sealed semiconductor device
View Patent ↗A molding equipment for a resin shielding semiconductor device includes a lower platen having a lower cavity, and an upper platen having an upper cavity, and a recess which is adjacent to the upper cavity. A lead frame has an opening serving as a passage of resin. The opening has one end rounded.
1. A lead frame for the semiconductor device from which surplus resin can be detached without leaving burrs, comprising:
a first region in which a semiconductor chip can be encapsulated with resin; and
a second region, which is adapted to be placed at a runner of a mold, in which an opening is formed, the opening having one end, which extends to the first region, and another end opposite to the one end being rounded.
2. A lead frame as claimed in claim 1 wherein the opening includes a first part and a second part, the first part being rectangularity shaped and the second part being semicircularily shaped.
3. A lead frame as claimed in claim 2 wherein the sides acing to each other of the first part are parallel to sides of the lead frame.
4. A lead frame as claimed in claim 1 wherein the first part is used for passing resin material, and the second part is used for storing resin material.