Method of forming a head assembly
View Patent ↗Methods of forming a head assembly, a head assembly, and a linear tape drive are provided. One aspect provides a method of forming a head assembly including providing a base member; forming a plurality of head components upon the base member individually adapted to communicate information relative to a tape; providing a plurality of component regions adjacent respective ones of the head components and a path of travel of the tape; and providing a support region intermediate adjacent ones of the head components and positioned to support the tape moving along the path of travel, the support region comprising a material different than a material of the component regions.
1. A method of forming a head assembly comprising:
providing a base member;
forming a plurality of head components upon the base member individually adapted to communicate information relative to media;
providing a plurality of component regions between respective ones of the head components and a path of travel of the media;
providing a support region intermediate adjacent ones of the head components and positioned to support the media moving along the path of travel, the support region comprising a material different than a material of the component regions; and
providing an insulating layer and wherein the providing the support region comprises removing portions of the insulating layer to form the support region.
2. The method in accordance with claim 1 wherein the providing the support region comprises providing the support region comprising a material having a hardness greater than a material of the component regions.
3. The method in accordance with claim 1 wherein the providing the support region comprises providing the support region comprising a material having a greater resistance to wear than a material of the component regions.
4. The method in accordance with claim 1 wherein the forming comprises forming the head components to individually comprise a read element and a write element.
5. The method in accordance with claim 1 wherein the forming comprises forming the head components to communicate using Linear Tape Open technology.
6. The method in accordance with claim 1 wherein the providing the support region comprises forming the support region upon a cover member and placing the cover member adjacent the base member.
7. The method in accordance with claim 6 wherein the forming the support region upon the cover member comprises removing portions of the cover member.
8. The method in accordance with claim 1 wherein the providing the support region comprises depositing support region material over the base member.
9. The method in accordance with claim 1 wherein the providing the base member comprises providing a wafer substrate.
10. The method in accordance with claim 1 wherein the forming comprises forming head components individually configured to communicate digital information relative to the media comprising a magnetic tape.
11. The method in accordance with claim 1 wherein the providing the component regions comprises providing the component regions immediately adjacent to the media moving along the path of travel.
12. The method in accordance with claim 1 wherein the providing the component regions comprises positioning the component regions to contact the media moving along the path of travel.
13. A method of forming a head assembly comprising:
providing a base member;
forming a plurality of head components upon the base member individually adapted to communicate information relative to media;
providing a plurality of component regions between respective ones of the head components and a path of travel of the media;
providing a support region intermediate adjacent ones of the head components and positioned to support the media moving along the path of travel, the support region comprising a material different than a material of the component regions;
wherein the providing the support region comprises forming the support region upon a cover member and placing the cover member adjacent the base member; and
wherein the forming the support region upon the cover member comprises removing portions of the cover member.