External coating composition for toaster pastries and other pastry products
View Patent ↗A toaster pastry at least partially coated with a clear coating that provides an at least partial moisture barrier on the surface of the toaster pastry.
1. A composition comprising:
A toaster pastry product having a surface at least partially coated with a dried coating composition that is invisible on the toaster pastry product comprising a modified wheat starch and a film forming agent comprising corn dextrin, wherein the dried composition provides at least a partial moisture barrier on the surface of the toaster pastry product, and wherein the toaster pastry product comprises wheat flour, and wherein the modified wheat starch is present in an amount of from 49.31% by weight of the dry ingredients of the coating composition to about 100% by weight of the dry ingredients of the coating composition, and wherein the coating is applied as a slurry and the slurry is coated directly onto the surface of the toaster pastry.
2. The composition of claim 1 , wherein the toaster pastry product comprises a low moisture content dough.
3. The composition of claim 2 , wherein the slurry is applied to the toaster pastry product at a temperature of from about 40° F. to about 100° F. and the coating composition provides a moisture barrier on the toaster pastry product where the coating composition is applied to the toaster pastry product.
4. The composition of claim 2 , wherein the slurry comprises from about 5% to about 46% slurry solids and wherein the modified wheat starch is an oxidized and substituted wheat starch.
5. The composition of claim 4 , wherein the slurry comprises from about 30% to about 46% slurry solids and wherein the oxidized and substituted wheat starch is an oxidized and acetylated wheat starch where the substitution level is from 0.01% to about 1% acetylation.
6. The composition of claim 1 , wherein the dry ingredients of the coating composition comprise:
from 49.31% to about 100% by weight modified wheat starch;
from about 5% to about 75% by weight film-forming agent;
from about 0% to about 10% by weight leavening system;
from about 0% to about 30% by weight sweetener; and
from about 0% to about 3% by weight stabilizer.
7. The composition of claim 1 , wherein the modified wheat starch comprises an oxidized, substituted modified wheat starch and the coating composition comprises from about 32% to about 40% by dry weight corn dextrin.
8. The composition of claim 6 , wherein the coating composition comprises from about 32% to about 40% by dry weight corn dextrin.
9. The composition of claim 8 , wherein the corn dextrin is less than about 32% soluble in about 77° F. water.
10. The composition of claim 8 , wherein the corn dextrin is less than about 15% soluble in about 77° F. water.
11. The composition of claim 6 , wherein the leavening system comprises:
from about 0% to about 5% by dry weight sodium acid pyrophosphate; and
from about 0% to about 5% by dry weight sodium bicarbonate.
12. The composition of claim 6 , wherein the sweetener comprises granulated sugar.
13. The composition of claim 1 , wherein the coating composition further comprises water, thereby forming the slurry and the toaster pastry product has a slurry pickup of from about 5% to about 30% of the slurry on the pastry product after coating.
14. A composition comprising:
a toaster pastry substrate comprising wheat flour and having a surface, wherein the toaster pastry substrate is at least partially coated with a dried coating composition that is invisible on the toaster pastry product, where the dry ingredients of the coating composition comprise:
from 49.31% to about 100% by weight modified wheat starch;
from about 5% to about 75% by weight of a corn dextrin;
from about 0% to about 10% by weight of a leavening system;
from about 0% to about 30% by weight of a sweetener; and
from about 0% to about 3% by weight of a stabilizer; and
wherein the coating composition provides at least a partial moisture barrier on the surface of the toaster pastry substrate upon thermal processing, and wherein the coating is applied as a slurry and the slurry is coated directly onto the surface of the toaster pastry.
15. The composition of claim 14 , wherein the modified wheat starch comprises an oxidized, substituted modified wheat starch.
16. The composition of claim 15 , wherein the corn dextrin comprises a low-solubility corn dextrin.
17. The composition of claim 14 , wherein the leavening system comprises:
from about 0% to about 5% by dry weight sodium acid pyrophosphate; and
from about 0% to about 5% by dry weight sodium bicarbonate.
18. The composition of claim 14 , wherein the sweetener comprises granulated sugar.
19. A composition comprising:
a toaster pastry derived at least in part from wheat, having a surface and at least partially coated on the surface with a dried slurry comprising water and a mix of ingredients wherein the slurry is applied directly to the surface of the toaster pastry, and wherein the mix of ingredients comprises modified wheat starch in an amount of from 49.31% to about 60% by weight of the mix of ingredients; corn dextrin in an amount of from about 20% to about 40% by weight of the mix of ingredients; sodium acid pyrophosphate in an amount from about 0.5% to about 2.5% by weight of the mix of ingredients; sodium bicarbonate in an amount of from about 0.5% to about 2.5% by weight of the mix of ingredients; granulated sugar in an amount of from about 10% to about 20% by weight of the mix of ingredients; a stabilizer in an amount of from about 0% to about 3% by weight of the mix of ingredients; wherein the slurry forms at least a partial moisture barrier on the surface of the toaster pastry upon thermal processing that and is invisible.
20. The composition of claim 19 , wherein the coating, upon thermal processing, forms a moisture barrier on a portion of the surface of the toaster pastry having the slurry applied and wherein the mix of ingredients comprises from about 32% to about 40% corn dextrin by weight of the mix of ingredients.
21. The composition of claim 20 , wherein the stabilizer comprises xanthan gum.
22. The composition of claim 21 , wherein the mix of ingredients comprises about 50% by weight modified wheat starch, about 32% by weight corn dextrin, about 1.8% by weight sodium acid pyrophosphate, about 1.2% by weight sodium bicarbonate, about 14% by weight granulated sugar, and about 0.15% by weight xanthan gum.
23. The composition of claim 19 , wherein the modified wheat starch comprises an oxidized and substituted wheat starch having a substitution level of about 0.1% and wherein the oxidized and substituted wheat starch comprises an oxidized and acetylated wheat starch.
24. The composition of claim 22 , wherein the modified wheat starch comprises an oxidized and substituted wheat starch having a substitution level of about 0.1% and wherein the oxidized and substituted wheat starch comprises an oxidized and acetylated wheat starch.
25. The composition of claim 19 , wherein the coating slurry has a viscosity of from about 8 to about 40 seconds as measured by the Stein viscosity method.
26. The composition of claim 24 , wherein the coating slurry has a viscosity of from about 8 to about 40 seconds as measured by the Stein viscosity method.
27. The composition of claim 14 , wherein the coating composition provides a moisture barrier where the coating composition has been applied to the surface of the pastry substrate and wherein the corn dextrin is present in an amount of from about 32% to about 40% by dry weight.
28. The composition of claim 27 , wherein the modified wheat starch comprises an oxidized, substituted wheat starch.
29. The composition of claim 28 , wherein the corn dextrin comprises a low-solubility corn dextrin.
30. The composition of claim 19 , wherein the stabilizer comprises xanthan gum.
31. The composition of claim 30 , wherein the modified wheat starch comprises an oxidized and substituted wheat starch having a substitution level of about 0.1% and wherein the oxidized and substituted wheat starch is an oxidized and acetylated wheat starch.