IP Library Granted Patent US 7,558,303
Granted Patent B2
US 7,558,303 · App. 10/636,167 · Granted Jul 7, 2009

Mounting arrangement for high-frequency electro-optical components

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Quick Facts
Patent No.
US 7,558,303
App. No.
10/636,167
Granted
Jul 7, 2009
Kind
B2
Abstract

An auxiliary component such as a bias inductance ( 6 ) associated with a laser source ( 2 ) is mounted generally “upright”, that is with its major dimension substantially orthogonal to the general plane of the submount (S) supporting both the laser ( 2 ) and the auxiliary component ( 6 ). The inductor ( 6 ) is preferably mounted at a location displaced laterally with respect to the lasing direction (X) of the laser source. The arrangement preferably includes a submount (S) with a recess ( 13 ) and at least part of the laser driver is arranged in the recess so that the driver ( 3 ) has an end surface extending from the recess substantially flush with the pad ( 12 ) for mounting the laser source. The arrangement minimises surface occupation as well as RF and EMI parasitic effects related to wirebonding.

Claims (20)

1. A mounting arrangement for a laser source and a bias inductance, said laser source and said bias inductance being mounted on a general plane of extension of a submount, wherein said bias inductance is mounted on said submount so that a longest dimension of said bias inductance is substantially orthogonal to said general plane of said submount, the mounting arrangement further comprising an electrically conductive area or pad for mounting said laser source as well as a driver for said laser source, and in that said submount has an outer surface and a recess recessed with respect to said outer surface, wherein at least part of said laser driver is arranged in said recess so that the driver has an end surface extending from the recess substantially flush with said conductive pad for mounting said laser source.

2. The mounting arrangement of claim 1 , wherein said laser source has a lasing direction and said bias inductance is displaced laterally with respect to said lasing direction of said laser source.

3. The mounting arrangement of claim 2 , wherein said laser source includes front and back lasing facets aligned along said lasing direction, said bias inductance has a surface exposed to radiation from said back facet of the laser source, and in that said surface is tilted laterally with respect to said lasing direction so that radiation from said laser back facet along said lasing direction is reflected away from such direction.

4. The mounting arrangement of claim 1 , wherein said bias inductance is mounted onto said submount by means of conductive glue.

5. The mounting arrangement of claim 1 , wherein said bias inductance is in the form of an SMD component.

6. A mounting arrangement comprising:

a laser source;

at least one auxiliary component associated with said laser source, said at least one auxiliary component having a major dimension;

a submount having a general plane of extension, an outer surface and a recess recessed with respect to said outer surface;

an electrically conductive area or pad for mounting said laser source; and

a driver for said laser source,

wherein said laser source and said auxiliary component are mounted on said general plane of extension of said submount, and said at least one auxiliary component is mounted with said major dimension substantially orthogonal to said general plane of said submount, and

wherein at least part of said laser driver is arranged in said recess so that the driver has an end surface extending from the recess substantially flush with said conductive pad for mounting said laser source.

7. A mounting arrangement comprising:

a submount having a general plane of extension; and

a laser source, and at least one auxiliary component associated with said laser source;

wherein said laser source and said auxiliary component are mounted on said submount,

wherein said at least one auxiliary component is mounted on said general plane of extension of said submount so that a longest dimension of said at least one auxiliary component is at least substantially orthogonal to said general plane of said submount,

wherein said laser source has a lasing direction and said auxiliary component is displaced laterally with respect to said lasing direction of said laser source, and

wherein said laser source includes front and back lasing facets aligned along said lasing direction, said auxiliary component has a surface exposed to radiation from said back facet of the laser source, and in that said surface is tilted laterally with respect to said lasing direction so that a major portion of the radiation projected from said laser back facet along said lasing direction and incident upon said surface of said auxiliary component, is reflected away from said lasing direction.

Assignments (8)
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENTS Recorded Feb 3, 2017
From: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 041710/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE NAME PREVIOUSLY RECORDED AT REEL: 017206 FRAME: 0666. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded May 6, 2016
From: AGILENT TECHNOLOGIES, INC.
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 038632/0662 →
PATENT SECURITY AGREEMENT Recorded Feb 11, 2016
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 037808/0001 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENT RIGHTS (RELEASES RF 032851-0001) Recorded Feb 2, 2016
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 037689/0001 →
PATENT SECURITY AGREEMENT Recorded May 8, 2014
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 032851/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 25, 2006
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES FIBER IP (SINGAPORE) PTE. LTD.
Reel/Frame 017675/0294 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 22, 2006
From: AGILENT TECHNOLOGIES, INC.
To: AVAGO TECHNOLOGIES GENERAL IP PTE. LTD.
Reel/Frame 017206/0666 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 7, 2003
From: AGILENT TECHNOLOGIES ITALIA S.P.A.; AGILENT TECHNOLOGIES UK LIMITED
To: AGILENT TECHNOLOGIES, INC.
Reel/Frame 014408/0626 →