Telecommunications chassis and card
View Patent ↗A chassis and associated telecommunication circuit card are disclosed. The chassis has heat dissipation and flame containment features while accommodating a high density of the circuitry cards. Embodiments include an inner housing with a double-layer middle floor dividing the chassis into top and bottom chambers. Each layer has partially aligned slots, and an air gap is provided between the two layers. Embodiments also include a double-layer mesh cover with an air gap existing between the two mesh layers. Projections and grooves are provided on the inner surfaces of the inner housing to receive circuit cards having a guide on one edge and a fin on another. The circuit card includes conductor structures such as multiple board layers with paired and segregated conductors. The circuit card also includes some components positioned to cooperate with the ventilation features of the chassis and includes some components chosen for low-power consumption or reduced flammability.
1. A chassis for housing telecommunications cards, comprising:
an inner housing with vertical sidewalls, a top surface, and a bottom surface, wherein the top surface and the bottom surface have a plurality of openings;
wherein a front edge of the top surface, bottom surface, and each vertical sidewall defines an inner housing opening;
a first mesh cover overlaying at least a portion of the top surface of the inner housing, wherein the first mesh cover has a plurality holes that are smaller and more densely populated than the openings of the top surface and bottom surface; and
a second mesh cover overlaying the first mesh cover and the top surface with a separation existing between the second mesh cover and the first mesh cover, wherein the second mesh cover has a plurality holes that are smaller and more densely populated than the openings of the top surface and bottom surface.
2. The chassis of claim 1 , further comprising a middle floor disposed within the inner housing dividing each of the plurality of chambers into a top chamber and a bottom chamber.
3. The chassis of claim 1 , further comprising a bottom mesh cover underlaying the bottom surface.
4. The chassis of claim 1 , further comprising:
projections on the bottom surface and the top plate for receiving longitudinal guides of telecommunications cards; and
grooves in the top surface and the bottom plate for receiving longitudinal fins of telecommunications cards.
5. The chassis of claim 2 , wherein the middle floor includes a bottom plate and a top plate, wherein the top plate overlays the bottom plate with a separation between at least portions of the top plate, and the bottom plate, and wherein the bottom plate has slots that partially align with slots provided in the top plate.
6. The chassis of claim 5 , wherein the first horizontal surface further comprises a second ridge substantially parallel to the first ridge and wherein the one or more slots are positioned between the first ridge and the second ridge.