Semiconductor device, method of manufacturing the same, circuit board, and electronic instrument

1. A semiconductor device comprising:

a semiconductor substrate in which an integrated circuit is formed and which includes interconnects and electrodes, the interconnects electrically connected with the semiconductor substrate, and the electrodes being formed on the interconnects;

a resin layer formed on the semiconductor substrate;

a wiring pattern electrically connected with the electrodes;

a plurality of external terminals which are formed on the wiring pattern and supported by the resin layer; and

a plurality of dummy terminals formed above the resin layer so that each of the plurality of dummy terminals overlaps the resin layer without being electrically connected with the electrodes, the entire dummy terminal overlapping the resin layer.

2. The semiconductor device as defined in claim 1 ,

wherein an upper surface of the resin layer includes a first region which is located in an end portion of the resin layer and a second region which is closer to a center of the resin layer than the first region,

wherein the dummy terminals are formed in the first region, and

wherein the external terminals are formed in the second region.

3. The semiconductor device as defined in claim 2 ,

wherein the upper surface of the resin layer is in a shape of a rectangle, and

wherein the dummy terminals are formed at least at a pair of corners of the rectangle on a diagonal.

4. The semiconductor device as defined in claim 2 ,

wherein the upper surface of the resin layer has an oblong shape, and

wherein the dummy terminals are formed on both ends of the oblong shape in a longitudinal direction.

5. The semiconductor device as defined in claim 1 ,

wherein at least two of the dummy terminals are disposed adjacent to each other.

6. The semiconductor device as defined in claim 1 ,

wherein each of the dummy terminals is formed of a material different from a material for each of the external terminals.

7. The semiconductor device as defined in claim 1 ,

wherein each of the dummy terminals is formed to include a center portion formed of a resin and a surface layer formed of solder.

8. The semiconductor device as defined in claim 1 ,

wherein each of the dummy terminals is larger than each of the external terminals.

9. The semiconductor device as defined in claim 1 , further comprising:

a conductive film which is formed below the external terminals and the dummy terminals.

10. The semiconductor device as defined in claim 9 ,

wherein the conductive film is formed over the semiconductor substrate and under the resin layer.

11. The semiconductor device as defined in claim 9 ,

wherein the conductive film is formed to cover a region in which the integrated circuit is formed.

12. The semiconductor device as defined in claim 9 ,

wherein the conductive film is divided into a plurality of sections provided at an interval from each other.

13. The semiconductor device as defined in claim 12 ,

wherein the integrated circuit is formed in a region in which the plurality of sections forming the conductive film are formed.

14. The semiconductor device as defined in claim 9 ,

wherein the conductive film is electrically connected with the dummy terminals without being electrically connected with the electrodes.

15. A circuit board on which the semiconductor device as defined in claim 1 is mounted.

16. An electronic instrument having the semiconductor device as defined in claim 1 .

17. A method of manufacturing a semiconductor device comprising:

forming a resin layer on a semiconductor substrate in which an integrated circuit is formed and which includes interconnects and electrodes, the interconnects electrically connected with the semiconductor substrate, and the electrodes being formed on the interconnects;

forming a wiring pattern so as to be electrically connected with the electrodes;

forming a plurality of external terminals on the wiring pattern so as to be supported by the resin layer; and

forming a plurality of dummy terminals above the resin layer so that each of the plurality of dummy terminals overlaps the resin layer without being electrically connected with the electrodes, the entire dummy terminal overlapping the resin layer.