Method of testing FPC bonding yield and FPC having testing pads thereon
View Patent ↗A flexible printed circuit (FPC) having testing pads thereon is provided. The FPC comprises a plurality of bonding pads and a plurality of testing pads, wherein each of the testing pads is disposed corresponding to each of the bonding pads, and the testing pads are electrically isolated from the bonding pads. After the bonding pads of the FPC are bonded to pins of a display, the testing pads are electrically connected to the bonding pads on the FPC via the pins of the display. Therefore, the FPC bonding yield can be determined by measuring the electrical property of the testing pads.
1. A method for testing a flexible printed circuit (FPC) bonding yield, comprising:
providing a flexible printed circuit having a plurality of bonding pads thereon;
disposing a plurality of testing pads on the flexible printed circuit, wherein each of the testing pads is disposed corresponding to each of the bonding pads, and the testing pads are electrically isolated from the bonding pads;
providing a liquid crystal display having a plurality of pins thereon;
performing a bonding process, so that each of the bonding pads and the corresponding testing pad of the flexible printed circuit are electrically connected to the same pin of the liquid crystal display;
inputting a testing signal into the flexible printed circuit; and
measuring an output signal from the testing pads, so as to determine the bonding yield between the flexible printed circuit and the liquid crystal display.
2. The method for testing the flexible printed circuit bonding yield of claim 1 , wherein the method for disposing the testing pads on the flexible printed circuit is by forming a plurality of conductive pads on the flexible printed circuit.
3. The method for testing the flexible printed circuit bonding yield of claim 2 , wherein the conductive pads are made of copper.
4. The method for testing the flexible printed circuit bonding yield of claim 1 , wherein the bonding process comprises:
disposing an anisotropic conductive adhesive in between the flexible printed circuit and the liquid crystal display; and
performing a pressing step, so that the bonding pads and the testing pads of the flexible printed circuit are electrically connected to the pins of the liquid crystal display.
5. A method for testing a flexible printed circuit bonding yield, comprising:
providing a flexible printed circuit having a plurality of bonding pads thereon;
forming a plurality of openings on the flexible printed circuit, wherein each of the openings is disposed corresponding to each of the bonding pads respectively, and the openings are separated from the bonding pads;
providing a liquid crystal display having a plurality of pins thereon;
performing a bonding process, so that each of the bonding pads of the flexible printed circuit is electrically connected to the corresponding pin respectively, wherein each of the openings of the flexible printed circuit exposes one pin which is electrically connected to the bonding pad corresponding to the opening itself;
inputting a testing signal into the flexible printed circuit, and
measuring an output signal from the pins exposed by the openings, so as to determine the bonding yield between the flexible printed circuit and the liquid crystal display.
6. The method for testing the flexible printed circuit bonding yield of claim 5 , wherein the bonding process comprises:
disposing an anisotropic conductive adhesive in between the flexible printed circuit and the liquid crystal display; and
performing a pressing step, so that the bonding pads of the flexible printed circuit are electrically connected to the pins of the liquid crystal display.
7. A method for testing a flexible printed circuit bonding yield, comprising:
providing a flexible printed circuit having a plurality of bonding pads thereon;
providing a liquid crystal display having a plurality of pins thereon, wherein each pin is corresponding to one bonding pad;
performing a bonding process, so that the bonding pads of the flexible printed circuit are electrically connected to the corresponding pins of the liquid crystal display respectively, wherein the flexible printed circuit expose a portion of the pins bonding with the bonding pads respectively;
inputting a testing signal into the flexible printed circuit; and
measuring an output signal from the exposed pins, so as to determine the bonding yield between the flexible printed circuit and the liquid crystal display.
8. The method for testing the flexible printed circuit bonding yield of claim 7 , wherein the bonding process comprises:
disposing an anisotropic conductive adhesive in between the flexible printed circuit and the liquid crystal display; and
performing a pressing step, so that the bonding pads of the flexible printed circuit are electrically connected to the pins of the liquid crystal display.